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BC618_06 PDF预览

BC618_06

更新时间: 2024-09-25 03:21:27
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管达林顿晶体管
页数 文件大小 规格书
6页 71K
描述
Darlington Transistors NPN Silicon

BC618_06 数据手册

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BC618  
Darlington Transistors  
NPN Silicon  
Features  
Pb−Free Packages are Available*  
http://onsemi.com  
COLLECTOR 1  
MAXIMUM RATINGS  
BASE  
2
Rating  
Symbol  
Value  
Unit  
CollectorEmitter Voltage  
V
V
V
55  
Vdc  
CEO  
CBO  
EBO  
CollectorBase Voltage  
Emitter−Base Voltage  
80  
12  
Vdc  
Vdc  
Adc  
EMITTER 3  
Collector Current − Continuous  
I
1.0  
C
Total Power Dissipation @ T = 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
Derate above T = 25°C  
A
Total Power Dissipation @ T = 25°C  
P
1.5  
12  
W
mW/°C  
A
D
Derate above T = 25°C  
A
TO−92  
CASE 29  
STYLE 17  
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
1
2
3
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
MARKING DIAGRAM  
Thermal Resistance, Junction−to−Ambient  
Thermal Resistance, Junction−to−Case  
R
q
JA  
JC  
R
q
83.3  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
BC  
618  
AYWW G  
G
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
BC618  
Package  
Shipping  
TO−92  
5000 Units / Bulk  
5000 Units / Bulk  
BC618G  
TO−92  
(Pb−Free)  
BC618RL1  
TO−92  
2000 / Tape & Reel  
2000 / Tape & Reel  
BC618RL1G  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 3  
BC618/D  

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