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BC618RLRM PDF预览

BC618RLRM

更新时间: 2024-11-04 21:14:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 73K
描述
1000mA, 55V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, CASE 29-11, TO-226AA, 3 PIN

BC618RLRM 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-92包装说明:CYLINDRICAL, O-PBCY-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.75
风险等级:5.46最大集电极电流 (IC):1 A
集电极-发射极最大电压:55 V配置:DARLINGTON
最小直流电流增益 (hFE):4000JEDEC-95代码:TO-92
JESD-30 代码:O-PBCY-T3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):225极性/信道类型:NPN
认证状态:Not Qualified表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICON标称过渡频率 (fT):150 MHz
Base Number Matches:1

BC618RLRM 数据手册

 浏览型号BC618RLRM的Datasheet PDF文件第2页浏览型号BC618RLRM的Datasheet PDF文件第3页浏览型号BC618RLRM的Datasheet PDF文件第4页浏览型号BC618RLRM的Datasheet PDF文件第5页浏览型号BC618RLRM的Datasheet PDF文件第6页 
BC618  
Darlington Transistors  
NPN Silicon  
Features  
These are Pb−Free Devices*  
http://onsemi.com  
COLLECTOR 1  
MAXIMUM RATINGS  
BASE  
2
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
Emitter−Base Voltage  
Symbol  
Value  
55  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
V
CEO  
V
CBO  
V
EBO  
80  
EMITTER 3  
12  
Collector Current − Continuous  
I
C
1.0  
Total Power Dissipation @ T = 25°C  
P
D
625  
5.0  
mW  
mW/°C  
A
Derate above T = 25°C  
A
TO−92  
CASE 29  
STYLE 17  
Total Power Dissipation @ T = 25°C  
P
D
1.5  
12  
W
mW/°C  
A
Derate above T = 25°C  
A
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
1
1
2
2
3
3
THERMAL CHARACTERISTICS  
Characteristic  
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction−to−Ambient  
Thermal Resistance, Junction−to−Case  
R
q
JA  
JC  
R
83.3  
q
MARKING DIAGRAM  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
BC  
618  
AYWW G  
G
A
Y
= Assembly Location  
= Year  
WW  
= Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
BC618G  
Package  
Shipping  
TO−92  
5000 Units / Bulk  
(Pb−Free)  
BC618RL1G  
TO−92  
(Pb−Free)  
2000 / Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
March, 2007 − Rev. 4  
BC618/D  

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