BAT54LP-TP-HF

更新时间： 2024-09-25 13:05:51

品牌	Logo	应用领域
美微科 - MCC		肖特基二极管光电二极管
页数	文件大小	规格书
3页	103K
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数据手册

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BAT54LP-TP-HF 数据手册

M C C

BAT54

THRU

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

21201 Itasca Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

BAT54S

Features

Low Forward Voltage

Surface Mount device

Very small conduction losses

250mWatt, 30Volt

Schottky Barrier Diode

MCC

Catalog

Number

BAT54

BAT54A

BAT54C

BAT54S

Device

Marking

Type

Configuration

(See Page 3)

SOT-23

L4P

L42

L43

L44

Single

Dual

Figure 1

Figure 2

Figure 3

Figure 4

Maximum Ratings

Continuos Reverse Voltage

Forward Current

V_R

I^F

30V

0.3A

Non-Repetitive Peak Forward Current t<1s

Total Power Dissipation @ T_A= 25°C

Storage Temperature Range

I_FSM

P_D

1.0mA

250mW

T_stg

T_j

-55°C to 150°C

150°C

DIMENSIONS

Junction Temperature

INCHES

MIN

Soldering temperature during 10s

T_j

260°C

DIM

MAX

.120

.098

.055

.041

.081

.024

.0039

.044

.007

.020

MIN

2.80

2.10

1.20

.89

1.78

.45

.013

.89

MAX

3.04

2.64

1.40

1.03

2.05

.60

.100

1.12

.180

.51

NOTE

.110

.083

.047

.035

.070

.018

.0005

.035

.003

.015

Electrical Characteristics @ 25 °C Unless Otherwise Specified

Ratings

Forward Voltage at

I_F= 0.1mA

Symbol

Max.

Notes

.085

.37

240mV

320mV

400mV

500mV

900mV

2.0 uA

>30V

I_F= 1mA

I_F= 10mA

I_F= 30mA

I_F= 100mA

V_F

Suggested Solder

Pad Layout

.031

.800

Reverse Current

Reverse Breakdown

Voltage

I_R

V_(BR)

V_R= 25V

.035

.900

.079

2.000

inches

Capacitance

C_J

t_rr

10pF

5nS

Measured at

1.0MHz, V_R=1.0V

I_F=I_R=10mA;

I_(REC)= 1mA

Reverse Recovery

Time

.037

.950

Thermal Resistance,

Junction to Ambient

R_qJA

500K/W

.037

.950

www.mccsemi.com

12 3

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