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AUIRF1010Z_12

更新时间: 2024-10-01 12:53:03
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英飞凌 - INFINEON /
页数 文件大小 规格书
15页 280K
描述
Advanced Process Technology

AUIRF1010Z_12 数据手册

 浏览型号AUIRF1010Z_12的Datasheet PDF文件第2页浏览型号AUIRF1010Z_12的Datasheet PDF文件第3页浏览型号AUIRF1010Z_12的Datasheet PDF文件第4页浏览型号AUIRF1010Z_12的Datasheet PDF文件第5页浏览型号AUIRF1010Z_12的Datasheet PDF文件第6页浏览型号AUIRF1010Z_12的Datasheet PDF文件第7页 
PD - 97458A  
AUIRF1010Z  
AUIRF1010ZS  
AUTOMOTIVE GRADE  
AUIRF1010ZL  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to  
Tjmax  
D
V(BR)DSS  
55V  
7.5m  
RDS(on) max.  
G
Lead-Free,RoHSCompliant  
Automotive Qualified *  
ID (Silicon Limited)  
ID (Package Limited)  
94A  
75A  
S
Description  
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low on-  
resistance per silicon area. Additional features of  
this design are a 175°C junction operating tempera-  
ture, fast switching speed and improved repetitive  
avalanche rating . These features combine to make  
this design an extremely efficient and reliable device  
for use in Automotive applications and a wide variety  
of other applications.  
D
D
D
S
D
S
S
D
D
G
G
G
D2Pak  
TO-262  
TO-220AB  
AUIRF1010ZS  
AUIRF1010ZL  
AUIRF1010Z  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings  
only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power  
dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise  
specified.  
Parameter  
Max.  
94  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
66  
A
@ T = 25°C  
C
75  
360  
140  
DM  
P
@T = 25°C  
C
Power Dissipation  
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
0.90  
± 20  
W/°C  
V
V
GS  
EAS  
130  
180  
mJ  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
mJ  
Repetitive Avalanche Energy  
T
J
-55 to + 175  
Operating Junction and  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Mounting Torque, 6-32 or M3 screw  
300  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.11  
–––  
62  
Units  
RJC  
Junction-to-Case  
RCS  
RJA  
RJA  
0.50  
–––  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
40  
Junction-to-Ambient (PCB Mount)  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
08/13/2012  

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