PD - 97458A
AUIRF1010Z
AUIRF1010ZS
AUTOMOTIVE GRADE
AUIRF1010ZL
Features
HEXFET® Power MOSFET
●
●
●
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●
Advanced Process Technology
UltraLowOn-Resistance
175°COperatingTemperature
Fast Switching
Repetitive Avalanche Allowed up to
Tjmax
D
V(BR)DSS
55V
7.5m
RDS(on) max.
G
●
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Lead-Free,RoHSCompliant
Automotive Qualified *
ID (Silicon Limited)
ID (Package Limited)
94A
75A
S
Description
Specifically designed for Automotive applications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of
this design are a 175°C junction operating tempera-
ture, fast switching speed and improved repetitive
avalanche rating . These features combine to make
this design an extremely efficient and reliable device
for use in Automotive applications and a wide variety
of other applications.
D
D
D
S
D
S
S
D
D
G
G
G
D2Pak
TO-262
TO-220AB
AUIRF1010ZS
AUIRF1010ZL
AUIRF1010Z
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power
dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise
specified.
Parameter
Max.
94
Units
Continuous Drain Current, VGS @ 10V (Silicon Limited)
I
I
I
I
@ T = 25°C
C
D
D
D
@ T = 100°C
C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
66
A
@ T = 25°C
C
75
360
140
DM
P
@T = 25°C
C
Power Dissipation
W
D
Linear Derating Factor
Gate-to-Source Voltage
0.90
± 20
W/°C
V
V
GS
EAS
130
180
mJ
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
EAS (tested )
IAR
See Fig.12a, 12b, 15, 16
A
EAR
mJ
Repetitive Avalanche Energy
T
J
-55 to + 175
Operating Junction and
T
Storage Temperature Range
°C
STG
Soldering Temperature, for 10 seconds (1.6mm from case )
Mounting Torque, 6-32 or M3 screw
300
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
Max.
1.11
–––
62
Units
RJC
Junction-to-Case
RCS
RJA
RJA
0.50
–––
°C/W
Case-to-Sink, Flat Greased Surface
Junction-to-Ambient
–––
40
Junction-to-Ambient (PCB Mount)
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
08/13/2012