生命周期: | Active | 包装说明: | HGQFF, |
Reach Compliance Code: | compliant | 风险等级: | 5.66 |
最长访问时间: | 18 ns | 其他特性: | ALSO DATA WIDTH CAN BE ORGANISED AS 8 BIT |
备用内存宽度: | 16 | JESD-30 代码: | S-CQFP-F68 |
长度: | 24.14 mm | 内存密度: | 16777216 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 68 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 512KX32 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | HGQFF |
封装形状: | SQUARE | 封装形式: | FLATPACK, HEAT SINK/SLUG, GUARD RING |
并行/串行: | PARALLEL | 座面最大高度: | 4.7 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | FLAT | 端子节距: | 1.27 mm |
端子位置: | QUAD | 宽度: | 24.14 mm |
Base Number Matches: | 1 |
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