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AS7C332MFT18A-75TQC PDF预览

AS7C332MFT18A-75TQC

更新时间: 2024-01-01 12:30:25
品牌 Logo 应用领域
ALSC 内存集成电路静态存储器
页数 文件大小 规格书
19页 512K
描述
3.3V 2M x 18 Flow-through synchronous SRAM

AS7C332MFT18A-75TQC 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.51
Is Samacsys:N最长访问时间:7.5 ns
其他特性:FLOW-THROUGH ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e3长度:20 mm
内存密度:37748736 bit内存集成电路类型:STANDARD SRAM
内存宽度:18功能数量:1
端子数量:100字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:2MX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):245认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

AS7C332MFT18A-75TQC 数据手册

 浏览型号AS7C332MFT18A-75TQC的Datasheet PDF文件第4页浏览型号AS7C332MFT18A-75TQC的Datasheet PDF文件第5页浏览型号AS7C332MFT18A-75TQC的Datasheet PDF文件第6页浏览型号AS7C332MFT18A-75TQC的Datasheet PDF文件第8页浏览型号AS7C332MFT18A-75TQC的Datasheet PDF文件第9页浏览型号AS7C332MFT18A-75TQC的Datasheet PDF文件第10页 
AS7C332MFT18A  
®
Synchronous truth table[4]  
[2]  
CE01  
H
L
CE1  
X
L
CE2  
X
X
X
H
H
L
ADSP ADSC ADV WRITE  
OE  
X
X
X
X
X
L
Address accessed  
NA  
CLK  
Operation  
Deselect  
DQ  
HiZ  
HiZ  
HiZ  
HiZ  
HiZ  
Q
X
L
L
X
L
X
X
X
X
X
X
X
X
X
L
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
L
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
NA  
Deselect  
L
L
H
L
NA  
Deselect  
L
X
X
H
H
H
H
X
X
X
X
X
X
X
X
H
X
X
X
X
X
L
NA  
Deselect  
L
H
L
NA  
Deselect  
L
X
X
L
External  
External  
External  
External  
Next  
Begin read  
L
L
L
H
L
Begin read  
HiZ  
Q
L
L
H
H
H
H
H
H
X
X
X
X
H
H
X
H
X
Begin read  
L
L
L
H
L
Begin read  
HiZ  
Q
X
X
X
X
H
H
H
H
L
X
X
X
X
X
X
X
X
L
H
H
H
H
H
H
H
H
L
Continue read  
Continue read  
Suspend read  
Suspend read  
Continue read  
Continue read  
Suspend read  
Suspend read  
Begin write  
Continue write  
Continue write  
Suspend write  
Suspend write  
L
H
L
Next  
HiZ  
Q
H
H
L
Current  
Current  
Next  
H
L
HiZ  
Q
L
H
L
Next  
HiZ  
Q
H
H
X
L
Current  
Current  
External  
Next  
H
X
X
X
X
X
HiZ  
3
D
X
H
X
H
X
X
X
X
H
H
H
H
L
D
D
D
D
L
L
Next  
H
H
L
Current  
Current  
L
1 X = don’t care, L = low, H = high  
2 For WRITE, L means any one or more byte write enable signals (BWa or BWb) and BWE are LOW or GWE is LOW. WRITE = HIGH for all BWx, BWE,  
GWE HIGH. See "Write enable truth table (per byte)," on page 6 for more information.  
3 For write operation following a READ, OE must be high before the input data set up time and held high throughout the input hold time  
4 ZZ pin is always Low.  
12/23/04, v 1.3  
Alliance Semiconductor  
7 of 19  

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