是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | LQFP, | 针数: | 100 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.53 |
最长访问时间: | 3.5 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PQFP-G100 | JESD-609代码: | e3 |
长度: | 20 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 100 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 1MX32 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LQFP |
封装形状: | RECTANGULAR | 封装形式: | FLATPACK, LOW PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 245 |
认证状态: | Not Qualified | 座面最大高度: | 1.6 mm |
最大供电电压 (Vsup): | 3.465 V | 最小供电电压 (Vsup): | 3.135 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | MATTE TIN | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 14 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
AS7C331MPFD32A-167BIN | ALSC |
获取价格 |
Standard SRAM, 1MX32, 3.4ns, CMOS, PBGA165, LEAD FREE, BGA-165 | |
AS7C331MPFD32A-167TQIN | ALSC |
获取价格 |
Standard SRAM, 1MX32, 3.4ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | |
AS7C331MPFD32A-200BIN | ALSC |
获取价格 |
Standard SRAM, 1MX32, 3.1ns, CMOS, PBGA165, LEAD FREE, BGA-165 | |
AS7C331MPFD32A-200TQC | ALSC |
获取价格 |
3.3V 1M x 32/36 pipelined burst synchronous SRAM | |
AS7C331MPFD32A-200TQCN | ALSC |
获取价格 |
3.3V 1M x 32/36 pipelined burst synchronous SRAM | |
AS7C331MPFD32A-200TQCN | ISSI |
获取价格 |
Standard SRAM, 1MX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | |
AS7C331MPFD32A-200TQI | ALSC |
获取价格 |
3.3V 1M x 32/36 pipelined burst synchronous SRAM | |
AS7C331MPFD32A-200TQI | ISSI |
获取价格 |
Standard SRAM, 1MX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | |
AS7C331MPFD32A-200TQIN | ALSC |
获取价格 |
3.3V 1M x 32/36 pipelined burst synchronous SRAM | |
AS7C331MPFD32A-200TQIN | ISSI |
获取价格 |
Standard SRAM, 1MX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 |