Datasheet > AS413RAD4N1FSZ

AS413RAD4N1FSZ

更新时间： 2024-09-19 03:23:39

品牌	Logo	应用领域
线艺 - COILCRAFT		/
页数	文件大小	规格书
2页	515K
描述
General Purpose Inductor, 0.0041uH, 1%, 1 Element, Ceramic-Core, SMD, CHIP, 1008

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AS413RAD4N1FSZ 数据手册

1008CHIPINDUCTORS

Outgassing Compliant Chip Inductors AS413RAD

temperatures up to 155°C. The leach-resistant base

metalization with tin-lead (Sn-Pb) terminations ensures

the best possible board adhesion.

ThisrobustversionofCoilcraft’sstandard1008HQseries

features high temperature materials that pass NASA low

outgassing speciﬁcations and allow operation in ambient

Inductance³

(nH)

Percent

SRF min⁵

(GHz)

DCR max⁶

(mOhms)

Imax

Part number¹

tolerance

Q min⁴

(A)

AS413RAD3N0_SZ²

AS413RAD4N1_SZ

AS413RAD7N8_SZ²

AS413RAD10N_SZ

AS413RAD12N_SZ

3.0 @ 50 MHz

4.1 @ 50 MHz

7.8 @ 50 MHz

10 @ 50 MHz

12 @ 50 MHz

5,2

57 @ 1000 MHz

75 @ 1000 MHz

51 @ 500 MHz

60 @ 500 MHz

57 @ 500 MHz

>5.00

3.80

3.20

2.40

1.8

1.6

1.5

AS413RAD18N_SZ

AS413RAD22N_SZ

AS413RAD33N_SZ

AS413RAD36N_SZ

AS413RAD39N_SZ

18 @ 50 MHz

22 @ 50 MHz

33 @ 50 MHz

36 @ 50 MHz

39 @ 50 MHz

5,2

62 @ 350 MHz

49 @ 150 MHz

57 @ 150 MHz

45 @ 150 MHz

2.10

2.05

1.70

1.40

1.30

1.4

1.2

1.1

AS413RAD47N_SZ

AS413RAD56N_SZ

AS413RAD68N_SZ

AS413RAD82N_SZ

AS413RADR10_SZ

47 @ 50 MHz

56 @ 50 MHz

68 @ 50 MHz

82 @ 50 MHz

100 @ 50 MHz

5,2,1

5,2

45 @ 150 MHz

43 @ 150 MHz

54 @ 150 MHz

51 @ 150 MHz

1.45

1.08

1.15

1.06

0.82

120

130

160

0.95

0.85

0.80

5,2

1. When ordering, please specify tolerance and testing codes:

Core material Ceramic

Terminations Tin-lead (63/37) over silver-platinum-glass frit

AS413RADR10JSZ

Ambient temperature –55°C to +125°C with Imax current, +125°C

to +155°C with derated current

Tolerance: F = 1% G = 2% J = 5%

Testing:

Z = COTS

H = Screening per Coilcraft CP-SA-10001

N = Screening per Coilcraft CP-SA-10003

2. Part is wound on low proﬁle coilform.

3. Inductance measured using a Coilcraft SMD-A ﬁxture in an Agilent/

HP 4286A impedance analyzer or equivalent with Coilcraft-provided

correlation pieces.

Storage temperature Component: –55°C to +155°C.

Packaging: –55°C to +80°C

Resistance to soldering heat Max three 40 second reﬂows at

+260°C, parts cooled to room temperature between cycles

Temperature Coefﬁcient of Inductance (TCL) +25 to +155 ppm/°C

4. Q measured using an Agilent/HP 4291A with an AgilentHP 16197A

test ﬁxture or equivalents.

5. SRF measured using an Aglilent/HP 8753ES network analyzeror

equivalent and a Coilcraft SMD-D test ﬁxture.

6. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a

Coilcraft CCF858 test ﬁxture.

7. Electrical speciﬁcations at 25°C.

Moisture Sensitivity Level (MSL) 1 (unlimited ﬂoor life at <30°C /

85% relative humidity)

Enhanced crush-resistant packaging 2000/7″reel

Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick,

4 mm pocket spacing, 1.8 mm pocket depth

Low proﬁle parts: Plastic tape: 8 mm wide, 0.3 mm thick,

4 mm pocket spacing, 1.6 mm pocket depth

Refer to Doc 362 “Soldering Surface Mount Components” before soldering.

These parts are preproduction products for electrical evaluation only.

Speciﬁcation subject to change without notice.

Document AS190-1 Revised 03/10/11

Phone 800-981-0363

Fax 847-639-1508

E-mail cps@coilcraft.com

Web www.coilcraft-cps.com

1102 Silver Lake Road

Cary IL 60013

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