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AS3SSD16GB5PBG PDF预览

AS3SSD16GB5PBG

更新时间: 2024-02-03 08:50:44
品牌 Logo 应用领域
AUSTIN 外围集成电路
页数 文件大小 规格书
17页 757K
描述
Solid State Disk On Chip (SSDoC)

AS3SSD16GB5PBG 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:BGA,针数:381
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.32其他特性:IT CAN ALSO WORK AT 5V SUPPLY
JESD-30 代码:S-PBGA-B381长度:31 mm
端子数量:381最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY认证状态:Not Qualified
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:31 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT

AS3SSD16GB5PBG 数据手册

 浏览型号AS3SSD16GB5PBG的Datasheet PDF文件第1页浏览型号AS3SSD16GB5PBG的Datasheet PDF文件第2页浏览型号AS3SSD16GB5PBG的Datasheet PDF文件第3页浏览型号AS3SSD16GB5PBG的Datasheet PDF文件第5页浏览型号AS3SSD16GB5PBG的Datasheet PDF文件第6页浏览型号AS3SSD16GB5PBG的Datasheet PDF文件第7页 
MICONDUCTOR, INC.  
                                                                   
                                                                   
                                                                     
                                                                     
                                                                       
                                                                       
                                                                           
                                                                           
                                                                             
                                                                             
                                                                               
                                                                               
                                                                                 
                                                                                 
SOLID STATE DISK  
AS3SSD4GB8PBG  
AS3SSD8GB8PBG  
AS3SSD16GB5PBG  
PRELIMINARY  
Austin Semiconductor, Inc.  
PRODUCT SPECIFICATIONS  
Capacity and User Addressable Sectors  
Unformatted  
4GB*  
User Addressable Sector in LBA mode  
7,880,544  
15,761,088  
31,522,176  
8GB*  
16GB*  
Note: Formatting and other functions will use some of the space, thus  
the listed capacity will not be available entirely for data storage.  
Read and Write Perfomance  
Operation  
READ  
Access Type  
MB/second  
Sustained Sequential Read Bandwidth  
Sustained Sequential Write Bandwidth  
16 MB/second  
5 MB/second  
WRITE  
OPERATING CONDITIONS  
Maximum Ratings  
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage  
to the device. This is a stress rating only, and functional operation of the device at these or any other  
conditions above those indicated in the operational sections of this specification is not guaranteed.  
Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
Absolute Maximum Ratings by Device  
Parameter  
Vcc supply voltage  
Symbol  
Vcc_P  
Ti  
Max.  
-0.5  
-40  
Min.  
+5.5  
+85  
Unit  
V
oC  
Non-Operation Temperature  
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.  
AS3SSD4GB8PBG,AS3SSD8GB8PBG,AS3SSD16GB5PBG  
Rev. 1.3 07/09  
4

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