生命周期: | Active | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 381 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.1 | Is Samacsys: | N |
其他特性: | IT CAN ALSO WORK AT 5V SUPPLY | JESD-30 代码: | S-PBGA-B381 |
JESD-609代码: | e0 | 长度: | 31 mm |
端子数量: | 381 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
最大供电电压: | 3.6 V | 最小供电电压: | 3 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 31 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
AS3SSD16GB5PBGR/CT | MICROSS | Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, ROHS COMPLIANT PACKAGE-381 |
获取价格 |
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AS3SSD16GB5PBGR/CT | AUSTIN | Solid State Disk On Chip (SSDoC) |
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|
AS3SSD16GB5PBGR/IT | AUSTIN | Solid State Disk On Chip (SSDoC) |
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|
AS3SSD4GB8PBG | AUSTIN | Solid State Disk On Chip (SSDoC) |
获取价格 |
|
AS3SSD4GB8PBG/CT | MICROSS | Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, PACKAGE-381 |
获取价格 |
|
AS3SSD4GB8PBG/IT | MICROSS | Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, PACKAGE-381 |
获取价格 |