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AS29LV800B-70RTC PDF预览

AS29LV800B-70RTC

更新时间: 2024-02-22 13:22:33
品牌 Logo 应用领域
ANADIGICS 闪存可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
25页 440K
描述
3V 1M】8/512K】16 CMOS Flash EEPROM

AS29LV800B-70RTC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1, TSSOP48,.8,20
针数:48Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.28最长访问时间:70 ns
备用内存宽度:8启动块:BOTTOM
命令用户界面:YES数据轮询:YES
耐久性:100000 Write/Erase CyclesJESD-30 代码:R-PDSO-G48
JESD-609代码:e0长度:18.4 mm
内存密度:8388608 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:1,2,1,15端子数量:48
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:16K,8K,32K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.1 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:12 mm
Base Number Matches:1

AS29LV800B-70RTC 数据手册

 浏览型号AS29LV800B-70RTC的Datasheet PDF文件第1页浏览型号AS29LV800B-70RTC的Datasheet PDF文件第3页浏览型号AS29LV800B-70RTC的Datasheet PDF文件第4页浏览型号AS29LV800B-70RTC的Datasheet PDF文件第5页浏览型号AS29LV800B-70RTC的Datasheet PDF文件第6页浏览型号AS29LV800B-70RTC的Datasheet PDF文件第7页 
AS29LV800  
March 2001  
®
Functional description  
The AS29LV800 is an 8 megabit, 3.0 volt Flash memory organized as 1 Megabyte of 8 bits/512Kbytes of 16 bits each. For  
flexible erase and program capability, the 8 megabits of data is divided into nineteen sectors: one 16K, two 8K, one 32K, and  
fifteen 64k byte sectors; or one 8K, two 4K, one 16K, and fifteen 32K word sectors. The ×8 data appears on DQ0–DQ7; the  
×16 data appears on DQ0–DQ15. The AS29LV800 is offered in JEDEC standard 48-pin TSOP and 44-pin SOP packages. This  
device is designed to be programmed and erased in-system with a single 3.0V VCC supply. The device can also be  
reprogrammed in standard EPROM programmers.  
The AS29LV800 offers access times of 70/80/90/120 ns, allowing 0-wait state operation of high speed microprocessors. To  
eliminate bus contention the device has separate chip enable (CE), write enable (WE), and output enable (OE) controls. Word  
mode (×16 output) is selected by BYTE = high. Byte mode (×8 output) is selected by BYTE = low.  
The AS29LV800 is fully compatible with the JEDEC single power supply Flash standard. Write commands are sent to the  
command register using standard microprocessor write timings. An internal state-machine uses register contents to control the  
erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase  
operations. Read data from the device occurs in the same manner as other Flash or EPROM devices. Use the program command  
sequence to invoke the automated on-chip programming algorithm that automatically times the program pulse widths and  
verifies proper cell margin. Use the erase command sequence to invoke the automated on-chip erase algorithm that  
preprograms the sector (if it is not already programmed before executing the erase operation), times the erase pulse widths,  
and verifies proper cell margin.  
Boot sector architecture enables the system to boot from either the top (AS29LV800T) or the bottom (AS29LV800B) sector.  
Sector erase architecture allows specified sectors of memory to be erased and reprogrammed without altering data in other  
sectors. A sector typically erases and verifies within 1.0 seconds. Hardware sector protection disables both program and erase  
operations in all, or any combination of, the nineteen sectors. The device provides true background erase with Erase Suspend,  
which puts erase operations on hold to either read data from, or program data to, a sector that is not being erased. The chip  
erase command will automatically erase all unprotected sectors.  
A factory shipped AS29LV800 is fully erased (all bits = 1). The programming operation sets bits to 0. Data is programmed into  
the array one byte at a time in any sequence and across sector boundaries. A sector must be erased to change bits from 0 to 1.  
Erase returns all bytes in a sector to the erased state (all bits = 1). Each sector is erased individually with no effect on other  
sectors.  
The device features single 3.0V power supply operation for Read, Write, and Erase functions. Internally generated and  
regulated voltages are provided for the Program and Erase operations. A low VCC detector automatically inhibits write  
operations during power transtitions. The RY/BY pin, DATA polling of DQ7, or toggle bit (DQ6) may be used to detect end of  
program or erase operations. The device automatically resets to the read mode after program/erase operations are completed.  
DQ2 indicates which sectors are being erased.  
The AS29LV800 resists accidental erasure or spurious programming signals resulting from power transitions. Control register  
architecture permits alteration of memory contents only after successful completion of specific command sequences. During  
power up, the device is set to read mode with all program/erase commands disabled when VCC is less than VLKO (lockout  
voltage). The command registers are not affected by noise pulses of less than 5 ns on OE, CE, or WE. To initiate write  
commands, CE and WE must be logical zero and OE a logical 1.  
When the devices hardware RESET pin is driven low, any program/erase operation in progress is terminated and the internal  
state machine is reset to read mode. If the RESET pin is tied to the system reset circuitry and a system reset occurs during an  
automated on-chip program/erase algorithm, data in address locations being operated on may become corrupted and requires  
rewriting. Resetting the device enables the system’s microprocessor to read boot-up firmware from the Flash memory.  
The AS29LV800 uses Fowler-Nordheim tunnelling to electrically erase all bits within a sector simultaneously. Bytes are  
programmed one at a time using EPROM programming mechanism of hot electron injection.  
3/22/01; V.1.0  
Alliance Semiconductor  
P. 2 of 25  

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