ARF1502

更新时间： 2024-02-09 20:39:00

品牌	Logo	应用领域
ADPOW		晶体晶体管放大器
页数	文件大小	规格书
2页	116K
描述
RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE

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中文翻译

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技术参数
数据手册

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ARF1502 技术参数

生命周期：	Active	包装说明：	,
Reach Compliance Code：	compliant	风险等级：	5.6
Base Number Matches：	1

ARF1502 数据手册

DYNAMIC CHARACTERISTICS

ARF1502

Symbol

C_iss

C_oss

C_rss

t_d(on)

t_r

Characteristic

Test Conditions

_GS= 0V

MIN

TYP

4820

800

210

MAX

6000

1100

290

UNIT

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Turn-on Delay Time

Rise Time

V_DS= 50V

f = 1 MHz

V_GS= 15V

V_DD= 0.5 V_DSS

I_D= I_D[Cont.]@ 25°C

R_G= 1.6 Ω

3.0

t_d(off)

t_f

Turn-off Delay Time

Fall Time

FUNCTIONAL CHARACTERISTICS

Symbol Characteristic

Test Conditions

MIN

TYP

MAX

UNIT

G_PS

Common Source Amplifier Power Gain

Drain Efficiency

f = 27.12 MHz

V_GS= 0V

V_DD= 65V

P_out= 900W

Electrical Ruggedness VSWR 10:1

No Degradation in Output Power

Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.

APT Reserves the right to change, without notice, the specifications and information contained herein.

TION

ANCED

1.065

HAZARDOUS MATERIAL

WARNING

.160

.500

The ceramic portion of the

device between leads and

mounting surface is beryllium

oxide. Beryllium oxide dust is

highly toxic when inhaled. Care

must be taken during handling

and mounting to avoid damage

to this area. These devices

must never be thrown away with

general industrial or domestic

waste.

ARF1500

BeO

135-05

1.065

dims: inches

.045

.500

.005

.207

.375

.207

INFORMA

.105 typ.

Thermal Considerations and Package Mounting:

The rated 1500W power dissipation is only available when the package mounting

surface is at 25˚C and the junction temperature is 200˚C. The thermal resistance

between junctions and case mounting surface is 0.12 ˚C/W. When installed, an addi-

tional thermal impedance of 0.09 ˚C/W between the package base and the mounting

surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint

compound must be used to reduce the effects of small surface irregularities. The heat-

sink should incorporate a copper heat spreader to obtain best results.

Clamp

Compliant

layer

ARF 1500

Heat Sink

The package is designed to be clamped to a heatsink. A clamped joint maintains the

required mounting pressure while allowing for thermal expansion of both the device

and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32

(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.

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