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AM79C850KCW PDF预览

AM79C850KCW

更新时间: 2024-10-29 08:28:27
品牌 Logo 应用领域
超微 - AMD 外围集成电路数据传输时钟
页数 文件大小 规格书
97页 331K
描述
SUPERNET-R 3

AM79C850KCW 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:FQFP,针数:208
Reach Compliance Code:unknownHTS代码:8542.31.00.01
Is Samacsys:N地址总线宽度:8
边界扫描:YES最大时钟频率:12.5 MHz
数据编码/解码方法:NRZI最大数据传输速率:12.5 MBps
外部数据总线宽度:16JESD-30 代码:S-PQFP-G208
长度:28 mm低功率模式:NO
DMA 通道数量:1I/O 线路数量:
串行 I/O 数:1端子数量:208
片上数据RAM宽度:最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:FQFP封装形状:SQUARE
封装形式:FLATPACK, FINE PITCH认证状态:Not Qualified
RAM(字数):0座面最大高度:3.95 mm
最大压摆率:400 mA最大供电电压:5.25 V
最小供电电压:4.75 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
宽度:28 mmuPs/uCs/外围集成电路类型:SERIAL IO/COMMUNICATION CONTROLLER, FDDI
Base Number Matches:1

AM79C850KCW 数据手册

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PRELIMINARY  
Advanced  
Micro  
Am79C850  
SUPERNET 3  
Devices  
DISTINCTIVE CHARACTERISTICS  
Compliant with the ANSI X3T9.5/ISO 9314  
ANSI-compliant TP-PMD Stream Cipher  
specification  
Scrambling/Descrambling  
— 100 Mbps data rate  
— Timed token-passing protocol  
— Ring topology  
Full duplex operation: 200 Mbps continuous  
data rate  
Supports both fiber optic and copper twisted-  
pair media  
Complete memory management  
Diagnostic features  
— Supports 256K bytes of local frame buffer  
memory  
— Built in Self Test (BIST) in Address Filter,  
Physical Layer Controller with Scrambler  
— Supports buffer memory bandwidths of  
200 Mbps and 400 Mbps  
Hardware Physical Connection Management  
support  
— Tag-Mode: minimum latency/highest  
performance buffer memory management, ideal  
for adapter card designs  
Low power consumption—reduction of more  
than 25% from SUPERNET 2 solution  
FUNCTIONAL OVERVIEW  
SUPERNET 3 FEATURES UPDATE  
SUPERNET 3 is a 208-pin CMOS integration of FDDI  
MAC, PHY, Address Filter, and clock generation and  
recovery functions. It is the third generation FDDI  
offering from AMD which integrates the SUPERNET 2  
family of chips into a single-chip solution. Refer to the  
SUPERNET 2 data book (PID 15502C) for basic  
feature descriptions.  
The basic feature description for SUPERNET 3 is  
provided in the SUPERNET 2 data book. The enhanced  
features are as listed below:  
This is a CMOS integration of the redesigned  
FORMAC Plus, an enhanced PLC, a 32-entry  
address filter (AF, which is based on a Content  
Addressable Memory, or CAM, core), and a CMOS  
PDX core for clock and data recovery.  
The SUPERNET 3 is backward compatible to the  
SUPERNET 2 Tag Mode of operation in which the  
SUPERNET 3 buffer memory interface logic maintains  
the buffer memory as multiple FIFOs.  
A 32-entry, extensible and fully maskable AF  
allows additional individual and group addresses to  
be supported.  
The SUPERNET 3 provides DMA channels, arbitrates  
access to the network buffer memory, and controls the  
data path between the buffer memory and the medium.  
The MAC also implements the timed-token protocol and  
receive/transmit control as specified for the Media  
Access Control (MAC) sublayer of the ISO standard  
9314-2 for FDDI. The Physical Layer functions defined  
by the ISO 9314-1 are performed by the SUPERNET 3.  
The physical data transmitter and receiver (PDX)  
circuits are also embedded on-chip using  
proprietary digital clock-recovery technology.  
For the purposes of implementing copper PMD,  
the scrambler/descrambler functions are  
embedded within the chip.  
The Buffer Memory interface has been modified to  
support slower SRAM’s (35 ns) without affecting  
backward compatibility with SUPERNET 2.  
SUPERNET  
3 implements on-chip digital clock  
recovery and transmit functions for fiber. To support  
copper media, the PHY-PMD interface is maintained  
and an external module can be implemented in  
the same footprint as the fiber optic transceiver to  
perform the MLT-3 encoding/decoding and equaliza-  
tion. SUPERNET 3 integrates the scrambler and  
descrambler functions for transmissions over  
copper media.  
SUPERNET 3 supports the FDDI single  
attachment station (SAS) but is capable of  
supporting a dual attachment station (DAS)  
Publication# 19574 Rev. A Amendment/0  
Issue Date: April 1995  
This document contains information on a product under development at Advanced Micro Devices, Inc. The information is intended  
to help you to evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice.  

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