Datasheet > ALN1956

ALN1956

更新时间： 2024-09-15 12:23:07

品牌	Logo	应用领域
ASB		/
页数	文件大小	规格书
3页	394K
描述
Internally Matched LNA Module

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ALN1956 数据手册

plerow^TMALN1956

Internally Matched LNA Module

Features

Description

The plerow^TMALN-series is the compactly designed surface-mount

module for the use of the LNA with or without the following gain blocks in

the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,

PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-

cation terminals, CATV and so on. It has an exceptional performance of

low noise figure, high gain, high OIP3, and low bias current. The stability

factor is always kept more than unity over the application band in order

to ensure its unconditionally stable implementation to the application

system environment. The surface-mount module package including the

completed matching circuit and other components necessary just in case

allows very simple and convenient implementation onto the system

board in mass production level.

· S₂₁= 29.2 dB@1920 MHz

= 28.8 dB@1980 MHz

· NF of 0.6 dB over Frequency

· Unconditionally Stable

· Single 5 V Supply

· High OIP3@Low Current

Specifications (in Production)

Typ.@T = 25 °C, V_s= 5 V, Freq. = 1950 MHz, Z_o.sys= 50 ohms

2-stage Single Type

Specifications

Parameter

Unit

Min

1920

Typ

Max

Frequency Range

Gain

MHz

1980

±0.2

0.6

More Information

Gain Flatness

±0.3

Noise Figure

0.65

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Output IP3

dBm

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

S11/S22

-18/-10

140

Output P1dB

dBm

msec

Switching Time ⁽³⁾

Supply Current

Supply Voltage

Impedance

110

Max. RF Input Power

Package Type & Size

Operating temperature is -40 °C to +85 °C.

dBm

C.W 29~31 (before fail)

Surface Mount Type, 13Wx13Lx3.8H

1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.

2) S11, S22 (max) is the worst value within the frequency band.

3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V_S.

Outline Drawing (Unit: mm)

Pin Number

Function

RF In

plerow

ALN1956

RF Out

ASB Inc.

Others

Ground

(Top View)

(Bottom View)

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

Solder Stencil Area

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

(Side View)

Ø0.4 plated thru holes to ground plane

(Recommended Footprint)

1/3

www.asb.co.kr

June 2010

12 3

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