Datasheet > ALN1103R2

ALN1103R2

更新时间： 2024-09-16 12:23:07

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ASB		/
页数	文件大小	规格书
4页	467K
描述
Internally Matched LNA Module

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ALN1103R2 数据手册

plerow^TMALN1103R2

Internally Matched LNA Module

Features

Description

The plerow^TMALN-series is the compactly designed surface-mount

module for the use of the LNA with or without the following gain blocks in

the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,

PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-

cation terminals, CATV and so on. It has an exceptional performance of

low noise figure, high gain, high OIP3, and low bias current. The stability

factor is always kept more than unity over the application band in order

to ensure its unconditionally stable implementation to the application

system environment. The surface-mount module package including the

completed matching circuit and other components necessary just in case

allows very simple and convenient implementation onto the system

board in mass production level.

· S₂₁= 33.9 dB@950 MHz

= 31.1 dB@1250 MHz

· NF of 0.65 dB over Frequency

· Unconditionally Stable

· Single 5 V Supply

· High OIP3@Low Current

Specifications (in Production)

Typ.@T = 25 °C, V_s= 5 V, Freq. = 1100 MHz, Z_o.sys= 50 ohms

2-stage Single Type

Specifications

Parameter

Unit

Min

950

31.5

Typ

Max

Frequency Range

Gain

MHz

1250

32.5

±1.4

0.65

Gain Flatness

±1.5

Noise Figure

Output IP3 ⁽¹⁾

S11/S22 ⁽²⁾

0.7

dBm

-14/-14

125

Output P1dB

dBm

msec

Switching Time ⁽³⁾

Supply Current

Supply Voltage

Impedance

105

Max. RF Input Power

Package Type & Size

Operating temperature is –40 °C to +85 °C.

dBm

C.W 29~31 (before fail)

Surface Mount Type, 10Wx10Lx3.8H

1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.

2) S11, S22 (max) is the worst value within the frequency band.

3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V_S.

Outline Drawing (Unit: mm)

Pin Number

Function

RF In

plerow

ALN1103R2

ASB Inc.

RF Out

Ground

(Top View)

(Bottom View)

Others

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

Solder Stencil Area

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

(Side View)

Ø0.4 plated thru holes to ground plane

(Recommended Footprint)

1/4

www.asb.co.kr

September 2012

12 3 4

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