plerowTM ALN1502BT
Internally Matched LNA Module
Features
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
· S21 = 15.5 dB@1400 MHz
= 14.5 dB@1600 MHz
· NF of 0.55 dB over Frequency
· Unconditionally Stable
· Single 3 V Supply
· High OIP3@Low Current
Specifications (in Production)
Typ.@T = 25 C, Vs = 3 V, Freq. = 1575 MHz, Zo.sys = 50 ohms
1-stage Single Type
Specifications
Parameter
Unit
Min
1400
14
Typ
Max
Frequency Range
Gain
MHz
dB
1600
15
0.5
0.55
30
More Information
Gain Flatness
Noise Figure
Output IP3 (1)
S11 / S22 (2)
Output P1dB
Switching Time (3)
Supply Current
Supply Voltage
Impedance
dB
0.7
dB
0.6
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
dBm
dB
28
-18 / -10
30
dBm
sec
mA
V
13.5
14.5
24
3
50
Max. RF Input Power
Package Type & Size
dBm
mm
C.W 23 ~ 25 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40 C to +85 C.
1) OIP3 is measured with two tones at an output power of 0 dBm/tone separated by 1 MHz.
2) S11, S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number
Function
RF In
2
5
6
plerow
RF Out
Vs
ALN1502BT
ASB Inc.
Others
Ground
(Top View)
(Bottom View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
Solder Stencil Area
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø 0.4 plated thru holes to ground plane
(Recommended Footprint)
1/3
www.asb.co.kr
March 2017
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