Internally Matched LNA Module
Features
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
· 30 dB Gain at 1810 MHz
· 19 dBm P1dB
· 37 dBm Output IP3
· 0.9 dB Noise Figure
· Operating at Single 5 V Supply
· 80 mA Current Consumption
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. =1810 MHz, Zo.sys = 50 ohm
2-stage Single Type
Specifications
Parameter
Unit
Min
1750
29
Typ
Max
1870
Frequency Range
Gain
MHz
dB
30
± 0.5
0.9
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Gain Flatness
dB
± 0.7
Noise Figure
dB
0.95
Output IP3 (1)
dBm
dB
36
18
37
S11 / S22 (2)
-14 / -14
100
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Output P1dB
dBm
µsec
mA
V
19
-
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Switching Time (3)
Supply Current
Supply Voltage
Impedance
80
5
50
Ω
Max. RF Input Power
Package Type & Size
Operating temperature is -40°C to +85°C.
dBm
mm
C.W 29 ~ 31 (before fail)
Surface Mount Type, 13Wx13Lx3.8H
1) OIP3 is measured with two tones at an output power of 10 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number
Function
RF In
plerow
ALN1810
3
8
RF Out
+Vcc
10
ASB Inc.
Others
Ground
(Top View)
(Bottom View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
Solder Stencil Area
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/5
www.asb.co.kr
September 2007
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