ADuM4121/ADuM4121-1
Data Sheet
Parameter
Symbol
tPSK
tPSKHL
tPSKLH
tPWD
Min
Typ
Max
22
12
15
13
Unit
ns
ns
ns
ns
Test Conditions/Comments
Skew3
CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω
CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω
CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω
CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω
CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω
Falling Edge4
Rising Edge5
Pulse Width Distortion
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity (CMTI)
Static CMTI6
7
18
tR/tF
|CM|
11
26
ns
150
150
kV/µs VCM = 1500 V
kV/µs VCM = 1500 V
Dynamic CMTI7
1 RGON and RGOFF are the external gate resistors in the test.
2 tDLH propagation delay is measured from the time of the input rising logic high threshold, VIH, to the output rising 10% threshold of the VOUT signal. tDHL propagation
delay is measured from the input falling logic low threshold, VIL, to the output falling 90% threshold of the VOx signal. See Figure 24 for waveforms of the propagation delay
parameters.
3 tPSK is the magnitude of the worst case difference in tDLH and/or tDHL that is measured between units at the same operating temperature, supply voltages, and output
load within the recommended operating conditions. See Figure 24 for waveforms of the propagation delay parameters.
4 tPSKHL is the magnitude of the worst case difference in tDHL that is measured between units at the same operating temperature, supply voltages, and output load within
the recommended operating conditions. See Figure 24 for waveforms of the propagation delay parameters.
5 tPSKLH is the magnitude of the worst case difference in tDLH that is measured between units at the same operating temperature, supply voltages, and output load within
the recommended operating conditions. See Figure 24 for waveforms of the propagation delay parameters.
6 Static common-mode transient immunity (CMTI) is defined as the largest dv/dt between GND1 and GND2, with inputs held either high or low, such that the output
voltage remains either above 0.8 × VDD2 for output high or 0.8 V for output low. Operation with transients above recommended levels can cause momentary data upsets.
7 Dynamic common-mode transient immunity (CMTI) is defined as the largest dv/dt between GND1 and GND2 with the switching edge coincident with the transient test
pulse. Operation with transients above the recommended levels can cause momentary data upsets.
REGULATORY INFORMATION
The ADuM4121/ADuM4121-1 are pending approval by the organizations listed in Table 2.
Table 2.
UL (Pending)
CSA (Pending)
VDE (Pending)
CQC (Pending)
UL1577 Component
Recognition Program
Approved under CSA Component Acceptance
Notice 5A
DIN V VDE V 0884-10
(VDE V 0884-10):2006-12
Certified under CQC11-
471543-2012
Single Protection, 5000 V rms
Isolation Voltage
CSA 60950-1-07+A1+A2 and IEC 60950-1, second
edition, +A1+A2:
Reinforced insulation, 849 V
peak, VIOSM = 10 kV peak
GB4943.1-2011
Basic insulation at 800 V rms (1131 V peak)
Basic insulation 849 V peak,
VIOSM = 16 kV peak
Basic insulation at 800 V rms
(1131 V peak)
Reinforced insulation at 400 V rms (565 V peak)
IEC 60601-1 Edition 3.1:
Reinforced insulation at
400 V rms (565 V peak)
Basic insulation (1 MOPP), 500 V rms (707 V peak)
Reinforced insulation (2 MOPP), 250 V rms
(1414 V peak)
CSA 61010-1-12 and IEC 61010-1 third edition
Basic insulation at: 600 V rms mains, 800 V
secondary (1089 V peak)
Reinforced insulation at: 300 V rms mains, 400 V
secondary (565 V peak)
File E214100
File 205078
File 2471900-4880-0001
File (pending)
PACKAGE CHARACTERISTICS
Table 3.
Parameter
Symbol
RI-O
CI-O
Min
Typ
1012
2.0
Max
Unit
Ω
pF
Test Conditions/Comments
Resistance (Input Side to High-Side Output)1
Capacitance (Input Side to High-Side Output)1
Input Capacitance
CI
4.0
pF
Junction to Top Characterization Parameter
ΨJT
7.3
°C/W
4-layer PCB
1 The device is considered a two-terminal device: Pin 1 through Pin 4 are shorted together, and Pin 5 through Pin 8 are shorted together.
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