Datasheet > ADSP-21364KBCZ-1AX

ADSP-21364KBCZ-1AX

更新时间： 2022-12-01 19:36:02

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
56页	1471K
描述
IC 16-BIT, 55.55 MHz, OTHER DSP, PBGA136, LEAD FREE, MO-205AE, BGA-136, Digital Signal Processor

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ADSP-21364KBCZ-1AX 数据手册

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Preliminary Technical Data

ADSP-21364

PACKAGE DIMENSIONS

The ADSP-21364 is available in a 136-ball Mini-BGA package

and a 144-lead integrated heatsink LQFP package.

10.40 BSC SQ

12.00 BSC SQ

0.80

BSC

TYP

PIN A1 INDICATOR

0.80

BSC

TYP

14 13 12 11 10 9

8 7 6 5 4 3 2 1

BOTTOM VIEW

TOP VIEW

1.70

MAX

DETAIL A

0.25

MIN

SEATING

PLANE

0.50

0.45

0.40

1. DIMENSIONS ARE IN MILIMETERS (MM).

2. THE ACTUAL POSITION OF THE BALL GRID IS

WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE

TO THE PACKAGE EDGES.

0.12 MAX (BALL

COPLANARITY)

(BALL

DIAMETER)

3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR

THE BALL DIAMETER.

4. CENTER DIMENSIONS ARE NOMINAL.

DETAIL A

Figure 43. 136-Ball Mini-BGA (BC-136-2)

Rev. PrD

Page 51 of 56

May 2005

1...48 49 505152 53 54...56

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