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ADM1067ASU-REEL PDF预览

ADM1067ASU-REEL

更新时间: 2024-02-08 15:58:38
品牌 Logo 应用领域
亚德诺 - ADI 转换器数模转换器
页数 文件大小 规格书
32页 649K
描述
Super Sequencer with Open-Loop Margining DACs

ADM1067ASU-REEL 数据手册

 浏览型号ADM1067ASU-REEL的Datasheet PDF文件第6页浏览型号ADM1067ASU-REEL的Datasheet PDF文件第7页浏览型号ADM1067ASU-REEL的Datasheet PDF文件第8页浏览型号ADM1067ASU-REEL的Datasheet PDF文件第10页浏览型号ADM1067ASU-REEL的Datasheet PDF文件第11页浏览型号ADM1067ASU-REEL的Datasheet PDF文件第12页 
ADM1067  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
Voltage on VH Pin  
Voltage on VPn Pins  
Voltage on VXn Pins  
16 V  
7 V  
−0.3 V to +6.5 V  
−0.3 V to +7 V  
5 V  
6.5 V  
6.5 V  
16 V  
7 V  
−0.3 V to +0.3 V  
VDDCAP + 0.6 V  
5 mA  
20 mA  
150°C  
Voltage on A0, A1 Pins  
Voltage on REFOUT Pin  
Voltage on VDDCAP, VCCP Pins  
Voltage on DACn Pins  
Voltage on PDOn Pins  
Voltage on SDA, SCL Pins  
Voltage on GND, AGND, PDOGND, REFGND Pins  
Voltage on MUP and MDN Pins  
Input Current at Any Pin  
Package Input Current  
Maximum Junction Temperature (TJ max)  
Storage Temperature Range  
Lead Temperature  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages.  
Table 4. Thermal Resistance  
Package Type  
40-Lead LFCSP  
48-Lead TQFP  
θJA  
25  
50  
Unit  
°C/W  
°C/W  
−65°C to +150°C  
ESD CAUTION  
Soldering Vapor Phase, 60 sec  
ESD Rating, All Pins  
215°C  
2000 V  
Rev. B | Page 9 of 32  
 

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