ADM1067
ABSOLUTE MAXIMUM RATINGS
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
Voltage on VH Pin
Voltage on VPn Pins
Voltage on VXn Pins
16 V
7 V
−0.3 V to +6.5 V
−0.3 V to +7 V
5 V
6.5 V
6.5 V
16 V
7 V
−0.3 V to +0.3 V
VDDCAP + 0.6 V
5 mA
20 mA
150°C
Voltage on A0, A1 Pins
Voltage on REFOUT Pin
Voltage on VDDCAP, VCCP Pins
Voltage on DACn Pins
Voltage on PDOn Pins
Voltage on SDA, SCL Pins
Voltage on GND, AGND, PDOGND, REFGND Pins
Voltage on MUP and MDN Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
40-Lead LFCSP
48-Lead TQFP
θJA
25
50
Unit
°C/W
°C/W
−65°C to +150°C
ESD CAUTION
Soldering Vapor Phase, 60 sec
ESD Rating, All Pins
215°C
2000 V
Rev. B | Page 9 of 32