ADM1067
OUTLINE DIMENSIONS
6.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
31
40
1
30
PIN 1
INDICATOR
0.50
BSC
TOP
VIEW
4.25
4.10 SQ
3.95
5.75
BCS SQ
EXPOSED
PAD
(BOTTOM VIEW)
0.50
0.40
0.30
21
10
11
20
0.25 MIN
4.50
REF
12° MAX
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 42. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40)
Dimensions shown in millimeters
1.20
9.00
0.75
0.60
0.45
MAX
BSC SQ
37
36
48
1
PIN 1
7.00
BSC SQ
TOP VIEW
(PINS DOWN)
0° MIN
1.05
1.00
0.95
0.20
0.09
7°
3.5°
0°
12
25
24
0.15
0.05
13
SEATING
PLANE
0.08 MAX
COPLANARITY
VIEW A
0.50
BSC
0.27
0.22
0.17
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026ABC
Figure 43. 48-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-48)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADM1067ACP
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
40-Lead LFCSP_VQ
40-Lead LFCSP_VQ
40-Lead LFCSP_VQ
40-Lead LFCSP_VQ
48-Lead TQFP
48-Lead TQFP
48-Lead TQFP
48-Lead TQFP
Evaluation Kit (LFCSP Version)
Evaluation Kit (TQFP Version)
Package Option
CP-40
CP-40
CP-40
CP-40
SU-48
SU-48
SU-48
SU-48
ADM1067ACP-REEL
ADM1067ACP-REEL7
ADM1067ACPZ1
ADM1067ASU
ADM1067ASU-REEL
ADM1067ASU-REEL7
ADM1067ASUZ1
EVAL-ADM1067LFEB
EVAL-ADM1067TQEB
1 Z = Pb-free part.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04635-0-11/06(B)
Rev. B | Page 32 of 32