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ADF4193BCPZ-RL7 PDF预览

ADF4193BCPZ-RL7

更新时间: 2024-02-26 13:57:01
品牌 Logo 应用领域
亚德诺 - ADI 信号电路锁相环或频率合成电路信息通信管理
页数 文件大小 规格书
28页 595K
描述
Low Phase Noise, Fast Settling PLL Frequency Synthesizer

ADF4193BCPZ-RL7 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.67
Is Samacsys:N模拟集成电路 - 其他类型:PLL FREQUENCY SYNTHESIZER
JESD-30 代码:S-XQCC-N32JESD-609代码:e3
长度:5 mm湿度敏感等级:3
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC32,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3 V认证状态:Not Qualified
座面最大高度:1 mm子类别:PLL or Frequency Synthesis Circuits
最大供电电流 (Isup):27 mA最大供电电压 (Vsup):3.3 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:5 mmBase Number Matches:1

ADF4193BCPZ-RL7 数据手册

 浏览型号ADF4193BCPZ-RL7的Datasheet PDF文件第22页浏览型号ADF4193BCPZ-RL7的Datasheet PDF文件第23页浏览型号ADF4193BCPZ-RL7的Datasheet PDF文件第24页浏览型号ADF4193BCPZ-RL7的Datasheet PDF文件第25页浏览型号ADF4193BCPZ-RL7的Datasheet PDF文件第26页浏览型号ADF4193BCPZ-RL7的Datasheet PDF文件第28页 
ADF4193  
ADSP-21xx Interface  
INTERFACING  
Figure 38 shows the interface between the ADF4193 and the  
ADSP-21xx digital signal processor. The ADF4193 needs a  
24-bit serial word for some writes. The easiest way to accom-  
plish this using the ADSP-21xx family is to use the autobuffered  
transmit mode of operation with alternate framing. This  
provides a means for transmitting an entire block of serial data  
before an interrupt is generated. Set up the word length for  
eight bits and use three memory locations for each 24-bit word.  
To program each 24-bit word, store the three 8-bit bytes, enable  
the autobuffered mode, and then write to the transmit register  
of the DSP. This last operation initiates the autobuffer transfer.  
The ADF4193 has a simple SPI®-compatible serial interface for  
writing to the device. CLK, DATA, and LE control the data  
transfer. When LE goes high, the 24 bits that have been clocked  
into the input register on each rising edge of CLK are latched  
into the appropriate register. See Figure 2 for the timing  
diagram and Table 5 for the register address table.  
The maximum allowable serial clock rate is 33 MHz.  
ADuC812 Interface  
Figure 37 shows the interface between the ADF4193 and the  
ADuC812 MicroConverter®. Because the ADuC812 is based on  
an 8051 core, this interface can be used with any 8051-based  
microcontroller. The MicroConverter is set up for SPI master  
mode with CPHA = 0. To initiate the operation, the I/O port  
driving LE is brought low. Some registers of the ADF4193  
require a 24-bit programming word. This is accomplished by  
writing three 8-bit bytes from the MicroConverter to the device.  
When the third byte is written, the LE input should be brought  
high to complete the transfer.  
ADSP-21xx  
ADF4193  
SCLK  
CLK  
DT  
DATA  
LE  
TFS  
MUX  
I/O FLAGS  
OUT  
(LOCK DETECT)  
An I/O port line on the ADuC812 can also be used to detect  
lock (MUXOUT configured as lock detect and polled by the  
port input).  
Figure 38. ADSP-21xx to ADF4193 Interface  
PCB DESIGN GUIDELINES FOR CHIP SCALE  
PACKAGE  
ADuC812  
ADF4193  
The lands on the chip scale package (CP-32-3) are rectangular.  
The printed circuit board (PCB) pad for these should be  
0.1 mm longer than the package land length and 0.05 mm wider  
than the package land width. The land should be centered on  
the pad. This ensures that the solder joint size is maximized.  
The bottom of the chip scale package has a central thermal pad.  
SCLOCK  
CLK  
MOSI  
DATA  
LE  
I/O PORTS  
MUX  
OUT  
(LOCK DETECT)  
The thermal pad on the PCB should be at least as large as the  
exposed pad. On the PCB, there should be a clearance of at least  
0.25 mm between the thermal pad and the inner edges of the  
pad pattern. This ensures that shorting is avoided.  
Figure 37. ADuC812 to ADF4193 Interface  
Thermal vias can be used on the PCB thermal pad to improve  
the thermal performance of the package. If vias are used, they  
should be incorporated in the thermal pad at 1.2 mm pitch grid.  
The via diameter should be between 0.3 mm and 0.33 mm, and  
the via barrel should be plated with one ounce copper to plug  
the via.  
The user should connect the PCB thermal pad to AGND  
.
Rev. B | Page 27 of 28  
 
 
 

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