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AD6641BCPZRL7-500 PDF预览

AD6641BCPZRL7-500

更新时间: 2024-01-09 08:42:53
品牌 Logo 应用领域
亚德诺 - ADI 转换器模数转换器光电二极管信息通信管理接收机
页数 文件大小 规格书
28页 632K
描述
250 MHz Bandwidth DPD Observation Receiver

AD6641BCPZRL7-500 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:56
Reach Compliance Code:compliantECCN代码:5A991.B
HTS代码:8542.39.00.01风险等级:5.76
Is Samacsys:N最大模拟输入电压:1.6 V
最小模拟输入电压:1.18 V转换器类型:ADC, PROPRIETARY METHOD
JESD-30 代码:S-XQCC-N56JESD-609代码:e3
长度:8 mm湿度敏感等级:3
模拟输入通道数量:1位数:12
功能数量:1端子数量:56
最高工作温度:85 °C最低工作温度:-40 °C
输出位码:OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE输出格式:PARALLEL, WORD
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260认证状态:Not Qualified
采样速率:500 MHz采样并保持/跟踪并保持:SAMPLE
座面最大高度:1 mm标称供电电压:1.9 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:8 mmBase Number Matches:1

AD6641BCPZRL7-500 数据手册

 浏览型号AD6641BCPZRL7-500的Datasheet PDF文件第7页浏览型号AD6641BCPZRL7-500的Datasheet PDF文件第8页浏览型号AD6641BCPZRL7-500的Datasheet PDF文件第9页浏览型号AD6641BCPZRL7-500的Datasheet PDF文件第11页浏览型号AD6641BCPZRL7-500的Datasheet PDF文件第12页浏览型号AD6641BCPZRL7-500的Datasheet PDF文件第13页 
AD6641  
ABSOLUTE MAXIMUM RATINGS  
Table 6.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
Electrical  
AVDD to AGND  
−0.3 V to +2.0 V  
DRVDD to DRGND  
AGND to DRGND  
AVDD to DRVDD  
SPI_VDDIO to AVDD  
SPI_VDDIO to DRVDD  
PD[5:0] to DRGND  
PCLK to DRGND  
PDOR to DRGND  
FULL to DRGND  
CLK to AGND  
−0.3 V to +2.0 V  
−0.3 V to +0.3 V  
−2.0 V to +2.0 V  
−2.0 V to +2.0 V  
THERMAL RESISTANCE  
−2.0 V to +2.0 V  
The exposed pad must be soldered to the ground plane for  
the LFCSP package. Soldering the exposed pad to the PCB  
increases the reliability of the solder joints, maximizing the  
thermal capability of the package.  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to SPI_VDDIO + 0.3 V  
−0.3 V to SPI_VDDIO + 0.3 V  
−0.3 V to SPI_VDDIO + 0.3 V  
−0.3 V to SPI_VDDIO + 0.3 V  
Table 7.  
Package Type  
θJA  
θJC  
Unit  
FILL to AGND  
56-Lead LFCSP_VQ (CP-56-1) 23.7  
1.7  
°C/W  
DUMP to AGND  
EMPTY to AGND  
VIN to AGND  
VREF to AGND  
CML to AGND  
Typical θJA and θJC are specified for a 4-layer board in still air.  
Airflow increases heat dissipation, effectively reducing θJA. In  
addition, metal in direct contact with the package leads from  
metal traces, through holes, ground, and power planes reduces  
the θJA.  
CSB to DRGND  
SP_SCLK, SP_SDFS to AGND  
SDIO to DRGND  
SP_SDO to DRGND  
Environmental  
ESD CAUTION  
Storage Temperature Range  
−65°C to +125°C  
Operating Temperature Range −40°C to +85°C  
Lead Temperature  
(Soldering, 10 sec)  
300°C  
Junction Temperature  
150°C  
Rev. 0 | Page 10 of 28  
 

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