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AB28F200BR-T80 PDF预览

AB28F200BR-T80

更新时间: 2024-02-08 02:01:36
品牌 Logo 应用领域
英特尔 - INTEL 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
36页 438K
描述
2-MBIT (128K X 16, 256K X 8) SmartVoltage BOOT BLOCK FLASH MEMORY FAMILY

AB28F200BR-T80 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:SOIC包装说明:0.525 X 1.110 INCH, PLASTIC, SOP-44
针数:44Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.69Is Samacsys:N
最长访问时间:80 ns其他特性:USER CONFIGURABLE 5V OR 12V VPP; DEEP POWER DOWN; TOP BOOT BLOCK; HARDWARE WRITE PROTECT
备用内存宽度:8启动块:TOP
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G44JESD-609代码:e0
长度:28.2 mm内存密度:2097152 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:1,2,1,1
端子数量:44字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-40 °C
组织:256KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP44,.63封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:2.95 mm
部门规模:16K,8K,96K,128K最大待机电流:0.00001 A
子类别:Flash Memories最大压摆率:0.07 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:MOS温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
切换位:NO类型:NOR TYPE
宽度:13.3 mmBase Number Matches:1

AB28F200BR-T80 数据手册

 浏览型号AB28F200BR-T80的Datasheet PDF文件第3页浏览型号AB28F200BR-T80的Datasheet PDF文件第4页浏览型号AB28F200BR-T80的Datasheet PDF文件第5页浏览型号AB28F200BR-T80的Datasheet PDF文件第7页浏览型号AB28F200BR-T80的Datasheet PDF文件第8页浏览型号AB28F200BR-T80的Datasheet PDF文件第9页 
A28F200BR  
E
Savings (APS) feature which minimizes system  
battery current drain, allowing for very low power  
designs. To provide even greater power savings,  
the boot block family includes a deep power-down  
mode which minimizes power consumption by  
turning most of the flash memory’s circuitry off.  
This mode is controlled by the RP# pin and its  
usage is discussed in Section 3.5, along with other  
power consumption issues.  
When the product is in the end-user’s hands, and  
updates or feature enhancements become  
necessary or mandatory, flash memory eliminates  
the need to replace an assembly. The update can  
be performed as part of routine maintenance  
operation  
by  
relatively  
unsophisticated  
technicians.  
The reliability of such a field upgrade is enhanced  
by a hardware-protected 16-Kbyte boot block. If  
the protection methods are implemented in the  
circuit design, the boot block will be  
unchangeable. Locating the boot-strap code in this  
area assures a fail-safe recovery from an update  
operation that failed to complete correctly.  
Additionally, the RP# pin provides protection  
against unwanted command writes due to invalid  
system bus conditions that may occur during  
system reset and power-up/down sequences.  
Also, when the flash memory powers-up, it  
automatically defaults to the read array mode, but  
during  
a
warm system reset, where power  
The two 8-Kbyte parameter blocks allow  
modification of control algorithms to reflect  
changes in the process or device being controlled.  
A variety of software algorithms allow these two  
blocks to behave like a standard EEPROM.  
continues uniterrupted to the system components,  
the flash memory could remain in a non-read  
mode, such as erase. Consequently, the system  
Reset pin should be tied to RP# to reset the  
memory to normal read mode upon activation of  
the Reset pin.  
Intel’s boot block architecture provides a flexible  
voltage solution for the different design needs of  
various applications. The asymmetrically-blocked  
memory map allows the integration of several  
memory components into a single flash device.  
The boot block provides a secure boot PROM; the  
parameter blocks can emulate EEPROM  
functionality for parameter store with proper  
software techniques; and the main blocks provide  
code and data storage with access times fast  
enough to execute code in place, decreasing RAM  
requirements.  
The byte-wide or word-wide input/output is  
controlled by the BYTE# pin. See Table 1 for a  
detailed description of BYTE# operations,  
especially the usage of the DQ15/A-1 pin.  
The 28F200 products are available in  
a
ROM/EPROM-compatible pinout and housed in  
the 44-lead PSOP (Plastic Small Outline)  
package.  
Refer to the DC Characteristics Table, Section 5.2  
for complete current and voltage specifications.  
Refer to the AC Characteristics Table, Section  
5.3, for read, program and erase performance  
specifications.  
1.4  
Pinouts  
Intel’s SmartVoltage boot block architecture  
provides upgrade paths in every package pinout to  
the 8-Mbit density. The 28F200 44-lead PSOP  
pinout follows the industry standard ROM/EPROM  
pinout as shown in Figure 2.  
1.3  
Applications  
The 2-Mbit boot block flash memory family  
combines high-density, low-power, high-  
Pinouts for the corresponding 4-Mbit and 8-Mbit  
components are also provided for convenient  
reference. 2-Mbit pinouts are given on the chip  
illustration in the center, with 2-Mbit and 8-Mbit  
pinouts going outward from the center.  
performance, cost-effective flash memories with  
blocking and hardware protection capabilities.  
Their flexibility and versatility reduce costs  
throughout the product life cycle. Flash memory is  
ideal for Just-In-Time production flow, reducing  
system inventory and costs, and eliminating  
component handling during the production phase.  
6
ADVANCE INFORMATION  

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