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AB28F400BX-B90 PDF预览

AB28F400BX-B90

更新时间: 2024-01-24 05:52:30
品牌 Logo 应用领域
英特尔 - INTEL 闪存
页数 文件大小 规格书
34页 461K
描述
4-MBIT 256K x16, 512K x8 BOOT BLOCK FLASH MEMORY FAMILY

AB28F400BX-B90 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:1.110 X 0.525 INCH, PLASTIC, SOP-44针数:44
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.77
最长访问时间:90 ns其他特性:BOTTOM BOOT BLOCK
备用内存宽度:8启动块:BOTTOM
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G44长度:28.2 mm
内存密度:4194304 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:1,2,1,3端子数量:44
字数:262144 words字数代码:256000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-40 °C组织:256KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP44(UNSPEC)
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:PARALLEL电源:5 V
编程电压:12 V认证状态:Not Qualified
座面最大高度:2.95 mm部门规模:16K,8K,96K,128K
最大待机电流:0.00008 A子类别:Flash Memories
最大压摆率:0.065 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:MOS
温度等级:AUTOMOTIVE端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
切换位:NO类型:NOR TYPE
宽度:13.3 mmBase Number Matches:1

AB28F400BX-B90 数据手册

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A28F400BX-T/B  
4-MBIT (256K x16, 512K x8) BOOT BLOCK FLASH  
MEMORY FAMILY  
Automotive  
Y
Y
Y
x8/x16 Input/Output Architecture  
Ð A28F400BX-T, A28F400BX-B  
Ð For High Performance and High  
Integration 16-bit and 32-bit CPUs  
Very High-Performance Read  
Ð 90 ns Maximum Access Time  
Ð 45 ns Maximum Output Enable Time  
Y
Y
Y
Low Power Consumption  
Ð 25 mA Typical Active Read Current  
Optimized High Density Blocked  
Architecture  
Ð One 16 KB Protected Boot Block  
Ð Two 8 KB Parameter Blocks  
Ð One 96 KB Main Block  
Deep Power-Down/Reset Input  
Ð Acts as Reset for Boot Operations  
Automotive Temperature Operation  
b
a
40 C to 125 C  
Ð
§
§
Write Protection for Boot Block  
Ð Three 128 KB Main Blocks  
Ð Top or Bottom Boot Locations  
Y
Y
Y
Y
Extended Cycling Capability  
Ð 1,000 Block Erase Cycles  
Hardware Data Protection Feature  
Ð Erase/Write Lockout During Power  
Transitions  
Automated Word/Byte Write and Block  
Erase  
Ð Command User Interface  
Ð Status Register  
Ð Erase Suspend Capability  
Y
Industry Standard Surface Mount  
Packaging  
Ð JEDEC ROM Compatible  
44-Lead PSOP  
Y
Y
SRAM-Compatible Write Interface  
Automatic Power Savings Feature  
Y
Y
12V Word/Byte Write and Block Erase  
e
g
12V 5% Standard  
Ð V  
PP  
Ð 1 mA Typical I  
CC  
Static Operation  
Active Current in  
ETOXTM III Flash Technology  
Ð 5V Read  
*Other brands and names are the property of their respective owners.  
Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or  
copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make  
changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.  
©
COPYRIGHT INTEL CORPORATION, 1995  
November 1995  
Order Number: 290501-003  

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