MKP9V160
Preferred Device
Sidac High Voltage
Bidirectional Triggers
Bidirectional devices designed for direct interface with the ac power
line. Upon reaching the breakover voltage in each direction, the device
switches from a blocking state to a low voltage on−state. Conduction
will continue like a Triac until the main terminal current drops below
the holding current. The plastic axial lead package provides high pulse
current capability at low cost. Glass passivation insures reliable
operation.
http://onsemi.com
(
)
SIDACS
0.9 AMPS RMS, 160 VOLTS
Features
• High Pressure Sodium Vapor Lighting
• Strobes and Flashers
• Ignitors
MT1
MT2
• High Voltage Regulators
• Pulse Generators
• Used to Trigger Gates of SCR’s and Triacs
•
Indicates UL Registered − File #E116110
• Pb−Free Package is Available
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
DO−41
AXIAL LEAD
CASE 59
Rating
Symbol
Value
Unit
Peak Repetitive Off−State Voltage
V
,
V
DRM
(Sine Wave, 50 to 60 Hz, T = −40 to 125°C)
V
"90
STYLE 2
J
RRM
On-State Current RMS
I
"0.9
A
A
T(RMS)
(T = 80°C, Lead Length = 3/8″″
L
All Conduction Angles)
Peak Non−repetitive Surge Current
(60 Hz One Cycle Sine Wave, T = 125°C)
I
"4.0
MARKING DIAGRAM
TSM
J
Operating Junction Temperature Range
Storage Temperature Range
T
−40 to +125
−40 to +150
°C
°C
J
A
MKP
9V160
YYWW G
G
T
stg
THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Thermal Resistance, Junction−to−Lead
Lead Length = 3/8″
R
40
°C/W
q
JL
A
Y
= Assembly Location
= Year
Lead Solder Temperature
(Lead Length w 1/16″ from Case, 10 s Max)
T
260
°C
L
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
MKP9V160RL
Axial Lead* 5000 Tape & Reel
MKP9V160RLG Axial Lead* 5000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 1
MKP9V160/D