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97SD3240RPMK PDF预览

97SD3240RPMK

更新时间: 2024-01-08 02:00:47
品牌 Logo 应用领域
麦斯威 - MAXWELL 动态存储器
页数 文件大小 规格书
39页 741K
描述
Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132

97SD3240RPMK 技术参数

生命周期:Obsolete包装说明:GQFF, QFL132,1.35SQ,25
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.36风险等级:5.7
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:6 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):133.33 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:S-XQFP-F132
长度:34.29 mm内存密度:1342177280 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:40
功能数量:1端口数量:1
端子数量:132字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:32MX40封装主体材料:UNSPECIFIED
封装代码:GQFF封装等效代码:QFL132,1.35SQ,25
封装形状:SQUARE封装形式:FLATPACK, GUARD RING
认证状态:Not Qualified刷新周期:8192
反向引出线:NO自我刷新:YES
连续突发长度:1,2,4,8最大待机电流:0.15 A
最小待机电流:3 V最大压摆率:0.575 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:0.635 mm
端子位置:QUAD总剂量:100k Rad(Si) V
宽度:34.29 mmBase Number Matches:1

97SD3240RPMK 数据手册

 浏览型号97SD3240RPMK的Datasheet PDF文件第7页浏览型号97SD3240RPMK的Datasheet PDF文件第8页浏览型号97SD3240RPMK的Datasheet PDF文件第9页浏览型号97SD3240RPMK的Datasheet PDF文件第11页浏览型号97SD3240RPMK的Datasheet PDF文件第12页浏览型号97SD3240RPMK的Datasheet PDF文件第13页 
97SD3240  
1.25Gb (8-Meg X 40-Bit X 4-Banks) SDRAM  
DQM Truth Table  
COMMAND  
SYMBOL  
CKE = N-1  
H
CKE = N  
x
DQM  
L
Byte (DQ0 to DQ39) write enable/output  
enable  
ENB  
Byte (DQ0 to DQ39) write inhibit/output dis-  
able  
MASK  
H
x
H
Note: H: V L: V x V or V  
IL  
IH  
IL  
IH  
Write: IDID is Needed  
Read: IDOD is Needed  
The SDRAM can mask input/output data by means of DQM.  
During reading, the output buffer is set to Low-Z by setting DQM to Low, enabling data output. On the other  
hand, when DQM is set High, the output buffer becomes High-Z, disabling data output.  
During writing, data is written by setting DQM to Low. When DQM is set to High, the previous data is held  
( the new data is not written). Desired data can be masked during burst read or burst write by setting DQM..  
For more details, refer to the DQM control section of the SDRAM operating instructions.  
CKE Truth Table  
CURRENT STATE  
COMMAND  
N-1  
N
CS  
RAS  
CAS  
WE  
ADDRESS  
Active  
Clock suspended mode entry  
Clock Suspend  
H
L
L
H
H
H
H
L
L
L
L
L
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Any  
Clock Suspend  
Clock Suspend mode exit  
Auto-refresh command (REF)  
Self-refresh entry (SELF)  
H
H
L
x
x
x
x
Idle  
Idle  
Idle  
L
L
L
H
x
L
L
H
x
H
H
H
x
L
L
L
Power down entry  
L
HL  
L
Self Refresh  
Power down  
Self Refresh exit (SELFX)  
H
H
H
H
H
x
H
H
x
H
H
x
L
Power down exit  
H
Note: H:V L:V x V or V  
IL  
IH  
IL  
IH  
02.04.05 Rev 3  
All data sheets are subject to change without notice 10  
©2005 Maxwell Technologies  
All rights reserved.  

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