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935324172557 PDF预览

935324172557

更新时间: 2024-11-08 21:09:31
品牌 Logo 应用领域
恩智浦 - NXP 微控制器外围集成电路
页数 文件大小 规格书
326页 4459K
描述
Microcontroller

935324172557 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.67
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

935324172557 数据手册

 浏览型号935324172557的Datasheet PDF文件第2页浏览型号935324172557的Datasheet PDF文件第3页浏览型号935324172557的Datasheet PDF文件第4页浏览型号935324172557的Datasheet PDF文件第5页浏览型号935324172557的Datasheet PDF文件第6页浏览型号935324172557的Datasheet PDF文件第7页 
Document Number: QFN_Addendum  
Rev. 0, 07/2014  
Freescale Semiconductor  
Addendum  
Addendum for New QFN  
Package Migration  
This addendum provides the changes to the 98A case outline numbers for products covered in this book.  
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See  
the table below for the old (gold wire) package versus the new (copper wire) package.  
To view the new drawing, go to Freescale.com and search on the new 98A package number for your  
device.  
For more information about QFN package use, see EB806: Electrical Connection Recommendations for  
the Exposed Pad on QFN and DFN Packages.  
© Freescale Semiconductor, Inc., 2014. All rights reserved.  

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