NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPC5777M
Rev. 6, 06/2016
MPC5777M
416 TEPBGA
27mm x 27 mm
512 TEPBGA
MPC5777M Microcontroller
Data Sheet
25 mm x 25 mm
• Three main CPUs, single issue, 32-bit CPU core complexes
(e200z7), one of which is a dedicated lockstep core.
– Dual phase-locked loops with stable clock domain for
peripherals and FM modulation domain for
computational shell
®
– Power Architecture embedded specification
compliance
• Dual crossbar switch architecture for concurrent access to
peripherals, flash, or RAM from multiple bus masters with
end-to-end ECC
• Hardware Security Module (HSM) to provide robust
integrity checking of flash memory
• System Integration Unit Lite (SIUL)
• Boot Assist Module (BAM) supports factory programming
using serial bootload through ‘UART Serial Boot Mode
Protocol’. Physical interface (PHY) can be:
– UART/LIN
– Instruction set enhancement allowing variable length
encoding (VLE), encoding a mix of 16-bit and 32-bit
instructions, for code size footprint reduction
– Single-precision floating point operations
– 16 KB Local instruction RAM and 64 KB local data
RAM
– 16 KB I-Cache and 4 KB D-Cache
• I/O Processor, dual issue, 32-bit CPU core complex
(e200z4), with
– Power Architecture embedded specification compliance
– Instruction set enhancement allowing variable length
encoding (VLE), encoding a mix of 16-bit and 32-bit
instructions, for code size footprint reduction
– Single-precision floating point operations
– Lightweight Signal Processing Auxiliary Processing
Unit (LSP APU) instruction support for digital signal
processing (DSP)
– CAN
• GTM104 — generic timer module
• Enhanced analog-to-digital converter system with
– Twelve separate 12-bit SAR analog converters
– Ten separate 16-bit Sigma-Delta analog converters
• Eight deserial serial peripheral interface (DSPI) modules
• Two Peripheral Sensor Interface (PSI5) controllers
• Three LIN and three UART communication interface
(LINFlexD) modules (6 total)
– 16 KB Local instruction RAM and 64 KB local data
RAM
– LINFlexD_0 is a Master/Slave
– 8 KB I-Cache
• 8640 KB on-chip flash
– LINFlexD_1, LINFlexD_2, LINFlexD_14,
LINFlexD_15, and LINFlexD_16 are Masters
• Four modular controller area network (MCAN) modules
and one time-triggered controller area network
(M-TTCAN)
– Supports read during program and erase operations, and
multiple blocks allowing EEPROM emulation
• 404 KB on-chip general-purpose SRAM including 64 KB
standby RAM (+ 192 KB data RAM included in the
CPUs). Of this 404 KB, 64 KB can be powered by a
separate supply so the contents of this portion can be
preserved when the main MCU is powered down.
• Multichannel direct memory access controllers (eDMA): 2
x 64 channels per eDMA (128 channels total)
• Triple Interrupt controller (INTC)
• External Bus Interface (EBI)
– Dual routing of accesses to EBI
– Access path determined by access address
– Access path downstream of PFLASH controller
– Allows EBI accesses to share buffer and prefetch
capabilities of internal flash
– Allows internal flash accesses to be remapped to
memories connected to EBI
NXP reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.