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844001AG PDF预览

844001AG

更新时间: 2024-01-04 19:07:11
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艾迪悌 - IDT /
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14页 242K
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844001AG 数据手册

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ICS844001  
FEMTOCLOCKS™ CRYSTAL-TO-LVDS CLOCK GENERATOR  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS844001.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS844001 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for V = 3.3V + 5% = 3.465V, which gives worst case results.  
DD  
Power (core) = V  
* (I  
+ I  
) = 3.465V * (115mA + 12mA) = 440mW  
DDA_MAX  
MAX  
DD_MAX  
DD_MAX  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device. The maximum recommended junction temperature is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = Junction Temperature  
θ
= Junction-to-Ambient Thermal Resistance  
JA  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
TA = Ambient Temperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ must be used. Assuming a  
JA  
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:  
70°C + 0.440W *90.5°C/W = 109.8°C. This is well below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and  
the type of board (single layer or multi-layer).  
TABLE 6. THERMAL RESISTANCE θ FOR 8-PIN TSSOP, FORCED CONVECTION  
JA  
θ by Velocity (Meters per Second)  
JA  
0
1
2.5  
Multi-Layer PCB, JEDEC Standard Test Boards  
101.7°C/W  
90.5°C/W  
89.8°C/W  
IDT/ ICSFEMTOCLOCKS™ CLOCK GENERATOR  
9
ICS844001 REV A NOVEMBER 2, 2012  

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