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840N021BGILFT PDF预览

840N021BGILFT

更新时间: 2024-11-03 01:10:51
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
13页 268K
描述
FemtoClock NG Crystal-to-LVCMOS/LVTTL Clock

840N021BGILFT 数据手册

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FemtoClock® NG  
Crystal-to-LVCMOS/LVTTL Clock  
840N021  
DATA SHEET  
General Description  
Features  
The 840N021 is a LVCMOS/LVTTL clock synthesizer designed for  
Ethernet applications. The device generates a 125MHz clock signal  
from a 25MHz crystal with excellent phase jitter performance. The  
device uses IDT’s fourth generation FemtoClock® NG technology for  
an optimum of high clock frequency, low phase noise performance  
and low power consumption.The device supports 2.5V or 3.3V  
voltage supply and is packaged in a small, lead-free (RoHS 6) 8-lead  
TSSOP package. The extended temperature range supports  
wireless infrastructure, telecommunication and networking end  
equipment requirements. The device is a member of the  
Fourth generation FemtoClock® NG technology  
125MHz output clock synthesized from a 25MHz fundamental  
mode crystal  
One 2.5V or 3.3V LVCMOS/LVTTL clock output  
Crystal interface designed for a 12pF parallel resonant crystal  
RMS phase jitter @ 125MHz, using a 25MHz crystal  
(1.875MHz - 20MHz): 0.156ps (maximum)  
RMS phase jitter @ 100MHz, using a 20MHz crystal  
(12kHz - 20MHz): 0.451ps (maximum)  
high-performance clock family from IDT.  
LVCMOS interface level for the output enable input  
Full 2.5V or 3.3V supply voltage  
Lead-free (RoHS 6) packaging  
-40°C to 85°C ambient operating temperature  
Use replacement part 840N202CKI-dddLF  
Frequency Table  
fXTAL (MHz)  
Q Output Frequency (MHz)  
20  
25  
100  
125  
Function Table  
Input  
OE  
Output Enable  
Output Q is disabled in high-impedance state  
Output Q is enabled.  
0
1 (default)  
NOTE: OE is an asynchronous control.  
Pin Assignment  
Block Diagram  
VDDA  
OE  
XTAL_OUT  
XTAL_IN  
1
2
3
4
8
7
6
5
VDD  
Q
GND  
DNU  
XTAL_IN  
PFD  
FemtoClock® NG  
VCO  
490-637.5MHz  
OSC  
Q
&
÷5  
LPF  
XTAL_OUT  
OE  
840N021  
÷25  
8-lead TSSOP  
4.40mm x 3.0mm x 0.925mm  
package body  
Pullup  
G Package  
Top View  
840N021 REVISION A 8/14/15  
1
©2015 Integrated Device Technology, Inc.  

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