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835-93-003-10-001 PDF预览

835-93-003-10-001

更新时间: 2024-09-13 17:51:43
品牌 Logo 应用领域
仕元机械 - MILL-MAX 连接器
页数 文件大小 规格书
2页 245K
描述
Board Connector

835-93-003-10-001 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8536.90.40.00
风险等级:5.86连接器类型:BOARD CONNECTOR
联系完成配合:GOLD (30) OVER NICKEL (100)联系完成终止:TIN LEAD (200) OVER NICKEL (150)
触点材料:NOT SPECIFIEDJESD-609代码:e0
Base Number Matches:1

835-93-003-10-001 数据手册

 浏览型号835-93-003-10-001的Datasheet PDF文件第2页 
INTERCONNECTS  
OFP Pass Thru Sockets for Ø.030” & .025” pins  
Single and Double Row  
Series 834, 835  
®
834/835 Series Pass Thru Sockets have a low  
.130” profile and will accept Ø.030” round pin,  
as well as industry standard .025” square pin  
headers.  
They are typically used to interconnect two or  
more parallel circuit boards.  
Sockets are designed for hand, wave or reflow*  
soldering. The high temp. insulator is compati-  
ble with all solder processes.  
®
Unique ORGANIC FIBRE PLUG barriers pre-  
vent solder, paste or flux from contaminating  
the internal spring contacts. After soldering, the  
®
OFP barriers are pushed out of the socket  
when the mating header is inserted.  
Mill-Max sockets use a precision machined  
brass sleeve with a press-fit beryllium copper  
“multi-finger” spring contact.  
Typical Application  
500%2  
#)2#5)4  
"/!2$  
).4%2ꢆ#/..%#4)/.  
0).  
Recommended mounting holes are Ø.046  
Œꢀꢁꢂꢁꢃ OR  
ꢀꢁꢄꢅꢃ 0).3  
.003” PTH (1,2 mm drilled prior to plating).  
ꢇꢈꢉ 302).'  
#/.4!#4  
*Intrusive reflow (also called "pin-in-paste") is a tech-  
nique of using conventional thru-hole components  
in a reflow soldering process. The pass thru socket  
is placed into plated-thru-holes in the circuit board  
(solder paste has previously been screen printed on  
pads adjacent to the holes) and the board is  
-)$$,%  
#)2#5)4  
"/!2$  
3/#+%4  
).35,!4/2  
0!33 4(25  
3/#+%43  
3/#+%4  
3,%%6%  
reflowed in the same pass as other SMT compo-  
nents. Solder will fill the plated-thru-holes and  
achieve solder joints as reliable as wave soldering.  
#)2#5)4  
"/!2$  
®
,/7%2  
#)2#5)4  
"/!2$  
The OFP barrier prevents solder paste from being  
picked-up inside the contact during assembly.  
¸
/2'!.)# &)"%2 0,5'  
3/,$%2  
*/).4  
053(%$ /54 "9 ).4%2ꢆ#/..%#4  
0). !&4%2 3/,$%2).'  
Patent Pending  
Ordering Information  
®
Single Row OFP Pass Thru Socket  
834-XX-0 _ _-10-001  
Fig. 1  
Fig. 2  
Specify # of pins  
®
01-64  
®
Fig. 1  
Double Row OFP Pass Thru Socket  
835-XX-0 _ _-10-001  
Specify # of pins  
02-72  
XX= Plating Code  
See Below  
SPECIFY PLATING CODE XX=  
93  
99  
200μ” Sn/Pb 200μSn/Pb  
30μ” Au 200μSn/Pb  
®
Sleeve (Pin)  
Fig. 2  
Contact (Clip)  
www.mill-max.com  
516-922-6000  
(6/04 - 550, 547, 535, 529)  

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