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74LVTN16244BDGG,12 PDF预览

74LVTN16244BDGG,12

更新时间: 2024-11-12 07:08:11
品牌 Logo 应用领域
恩智浦 - NXP 驱动信息通信管理光电二极管逻辑集成电路
页数 文件大小 规格书
16页 187K
描述
74LVTN16244B - 3.3 V 16-bit buffer/driver; 3-state TSSOP 48-Pin

74LVTN16244BDGG,12 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:TSSOP包装说明:TSSOP, TSSOP48,.3,20
针数:48Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.57
控制类型:ENABLE LOW系列:LVT
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:12.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大I(ol):0.064 A
湿度敏感等级:1位数:4
功能数量:4端口数量:2
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP48,.3,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TUBE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 VProp。Delay @ Nom-Sup:3.2 ns
传播延迟(tpd):4 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:MATTE TIN端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.1 mm

74LVTN16244BDGG,12 数据手册

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74LVTN16244B  
3.3 V 16-bit buffer/driver; 3-state  
Rev. 5 — 2 April 2012  
Product data sheet  
1. General description  
The 74LVTN16244B is a high-performance BiCMOS product designed for VCC operation  
at 3.3 V.  
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.  
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.  
2. Features and benefits  
16-bit bus interface  
3-state buffers  
Output capability: +64 mA and 32 mA  
TTL input and output switching levels  
Input and output interface capability to systems at 5 V supply  
Power-up 3-state  
Live insertion and extraction permitted  
No bus current loading when output is tied to 5 V bus  
Latch-up protection  
JESD78B Class II exceeds 500 mA  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVTN16244BDGG 40 C to +85 C  
TSSOP48  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
74LVTN16244BBX 40 C to +125 C  
HXQFN60  
plastic compatible thermal enhanced extremely SOT1134-2  
thin quad flat package; no leads; 60 terminals;  
body 4 6 0.5 mm  

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