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74LVTN16245BBX PDF预览

74LVTN16245BBX

更新时间: 2024-11-11 12:20:19
品牌 Logo 应用领域
恩智浦 - NXP 总线驱动器总线收发器逻辑集成电路信息通信管理
页数 文件大小 规格书
17页 160K
描述
3.3 V 16-bit transceiver; 3-state Output capability: 64 mA and 32 mA

74LVTN16245BBX 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:QFN包装说明:4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT1134-1, HXQFN-60
针数:60Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.7
Is Samacsys:N系列:LVT
JESD-30 代码:R-PBCC-B60长度:6 mm
逻辑集成电路类型:BUS TRANSCEIVER湿度敏感等级:2
位数:8功能数量:2
端口数量:2端子数量:60
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:HVBCC
封装形状:RECTANGULAR封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260传播延迟(tpd):3.5 ns
认证状态:Not Qualified座面最大高度:0.5 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子形式:BUTT端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:4 mmBase Number Matches:1

74LVTN16245BBX 数据手册

 浏览型号74LVTN16245BBX的Datasheet PDF文件第2页浏览型号74LVTN16245BBX的Datasheet PDF文件第3页浏览型号74LVTN16245BBX的Datasheet PDF文件第4页浏览型号74LVTN16245BBX的Datasheet PDF文件第5页浏览型号74LVTN16245BBX的Datasheet PDF文件第6页浏览型号74LVTN16245BBX的Datasheet PDF文件第7页 
74LVTN16245B  
3.3 V 16-bit transceiver; 3-state  
Rev. 3 — 15 June 2011  
Product data sheet  
1. General description  
The 74LVTN16245B is a high-performance BiCMOS product designed for VCC operation  
at 3.3 V.  
This device is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs  
in both send and receive directions. The control function implementation minimizes  
external timing requirements. The device features an output enable input (nOE) for easy  
cascading and a direction input (nDIR) for direction control.  
2. Features and benefits  
16-bit bus interface  
3-state buffers  
Output capability: +64 mA and 32 mA  
TTL input and output switching levels  
Input and output interface capability to systems at 5 V supply  
Power-up 3-state  
Live insertion and extraction permitted  
No bus current loading when output is tied to 5 V bus  
Latch-up protection  
JESD78B Class II exceeds 500 mA  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVTN16245BDGG 40 C to +85 C  
TSSOP48  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
74LVTN16245BBX 40 C to +85 C  
HXQFN60U plastic thermal enhanced extremely thin quad  
flat package; no leads; 60 terminals; UTLP  
based; body 4 6 0.5 mm  
SOT1134-1  

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