March 1999
Revised July 2001
74LVT16244 • 74LVTH16244
Low Voltage16-Bit Buffer/Line Driver
with 3-STATE Outputs
General Description
Features
■ Input and output interface capability to systems at
The LVT16244 and LVTH16244 contain sixteen non-invert-
ing buffers with 3-STATE outputs designed to be employed
as a memory and address driver, clock driver, or bus ori-
ented transmitter/receiver. The device is nibble controlled.
Individual 3-STATE control inputs can be shorted together
for 8-bit or 16-bit operation.
5V VCC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16244),
also available without bushold feature (74LVT16244).
■ Live insertion/extraction permitted
The LVTH16244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink −32 mA/+64 mA
■ Functionally compatible with the 74 series 16244
■ Latch-up performance exceeds 500 mA
■ ESD performance:
These buffers and line drivers are designed for low-voltage
(3.3V) VCC applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT16244 and
LVTH16244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation
Human-body model >2000V
Machine model >200V
Charged-drive model >1000V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Package
Order Number
Package Description
Number
74LVT16244GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
74LVT16244MEA
(Note 2)
MS48A
MTD48
BGA54A
MS48A
MTD48
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16244MTD
(Note 2)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16244GX
(Note 1)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
74LVTH16244MEA
(Note 2)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16244MTD
(Note 2)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1: BGA package available in Tape and Reel only.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
© 2001 Fairchild Semiconductor Corporation
DS500151
www.fairchildsemi.com