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74LCXZ16244MEAX PDF预览

74LCXZ16244MEAX

更新时间: 2024-02-09 14:58:54
品牌 Logo 应用领域
其他 - ETC 驱动器逻辑集成电路光电二极管
页数 文件大小 规格书
10页 204K
描述
Quad 4-Bit Buffer/Driver

74LCXZ16244MEAX 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TSSOP
包装说明:TSSOP, TSSOP48,.3,20针数:48
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.15
控制类型:ENABLE LOW系列:LVC/LCX/Z
JESD-30 代码:R-PDSO-G48JESD-609代码:e4
长度:12.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大I(ol):0.024 A
湿度敏感等级:2位数:4
功能数量:4端口数量:2
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP48,.3,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:4.5 ns
传播延迟(tpd):5.2 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.1 mm
Base Number Matches:1

74LCXZ16244MEAX 数据手册

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September 2000  
Revised August 2001  
74LCXZ16244  
Low Voltage 16-Bit Buffer/Line Driver  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
I 5V tolerant inputs and outputs  
The LCXZ16244 contains sixteen non-inverting buffers  
with 3-STATE outputs designed to be employed as a mem-  
ory and address driver, clock driver, or bus oriented trans-  
mitter/receiver. The device is nibble controlled. Each nibble  
has separate 3-STATE control inputs which can be shorted  
together for full 16-bit operation.  
I Guaranteed power up/down high impedance  
I Supports live insertion/withdrawal  
I 2.7V–3.6V VCC specifications provided  
I 4.5 ns tPD max (VCC = 3.0V), 20 µA ICC max  
When VCC is between 0 and 1.5V, the LCXZ12644 is in the  
I
24 mA output drive (VCC = 3.0V)  
high impedance state during power up or power down. This  
places the outputs in high impedance (Z) state preventing  
intermittent low impedance loading or glitching in bus ori-  
ented applications.  
I Implements patented noise/EMI reduction circuitry  
I Latch-up performance exceeds 500 mA  
I ESD performance:  
Human body model > 2000V  
Machine model > 200V  
The LCXZ16244 is designed for low voltage (2.7V or 3.3V)  
VCC applications with capability of interfacing to a 5V signal  
environment.  
I Also packaged in plastic Fine-Pitch Ball Grid Array  
The LCXZ16244 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCXZ16244GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LCXZ16244MEA  
(Note 2)  
MS48A  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LCXZ16244MTD  
(Note 2)  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500252  
www.fairchildsemi.com  

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