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74LCXZ16245 PDF预览

74LCXZ16245

更新时间: 2024-02-29 20:58:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 94K
描述
Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs

74LCXZ16245 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TSSOP
包装说明:TSSOP, TSSOP48,.3,20针数:48
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.16
控制类型:COMMON CONTROL计数方向:BIDIRECTIONAL
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G48
JESD-609代码:e4长度:12.5 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS TRANSCEIVER
最大I(ol):0.024 A湿度敏感等级:2
位数:8功能数量:2
端口数量:2端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.3,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:4.5 ns传播延迟(tpd):5.2 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
翻译:N/A宽度:6.1 mm
Base Number Matches:1

74LCXZ16245 数据手册

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March 2002  
Revised March 2002  
74LCXZ16245  
Low Voltage 16-Bit Bidirectional Transceiver  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCXZ16245 contains sixteen non-inverting bidirec-  
tional buffers with 3-STATE outputs and is intended for bus  
oriented applications. The device is designed for low volt-  
age (2.7V or 3.3V) VCC applications with capability of inter-  
2.7V–3.6V VCC specifications provided  
4.5 ns tPD max (VCC = 3.3V), 20 µA ICC max  
Power-down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
±24 mA output drive (VCC = 3.0V)  
facing to a 5V signal environment. The device is byte  
controlled. Each byte has separate control inputs which  
could be shorted together for full 16-bit operation. The T/R  
inputs determine the direction of data flow through the  
device. The OE inputs disable both the A and B ports by  
placing them in a high impedance state.  
Implements patented noise/EMI reduction circuitry  
Latch-up performance conforms to the requirements of  
JESD78  
When VCC is between 0V and 1.5V, the LCXZ16245 is on  
ESD performance:  
the high impedance state during power-up or power-down.  
This places the outputs in the high impedance (Z) state  
preventing intermittent low impedance loading or glitching  
in bus oriented applications.  
Human body model > 2000V  
Machine model > 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
The LCXZ16245 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to VCC through a pull-up resistor: the minimum value or the  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LCXZ16245GX  
(Note 2)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LCXZ16245MTD  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Note 2: BGA package available in Tape and Reel only.  
Logic Symbol  
© 2002 Fairchild Semiconductor Corporation  
DS500580  
www.fairchildsemi.com  

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