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72V36100L10BBG PDF预览

72V36100L10BBG

更新时间: 2024-11-25 00:31:39
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
48页 310K
描述
3.3 VOLT HIGH-DENSITY SUPERSYNC II

72V36100L10BBG 数据手册

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3.3 VOLT HIGH-DENSITY SUPERSYNC II™  
36-BIT FIFO  
65,536 x 36  
131,072 x 36  
IDT72V36100  
IDT72V36110  
Empty, Full and Half-Full flags signal FIFO status  
Programmable Almost-Empty and Almost-Full flags, each flag can  
default to one of eight preselected offsets  
Selectable synchronous/asynchronous timing modes for Almost-  
Empty and Almost-Full flags  
Program programmable flags by either serial or parallel means  
Select IDT Standard timing (using EF and FF flags) or First Word  
Fall Through timing (using OR and IR flags)  
Output enable puts data outputs into high impedance state  
Easily expandable in depth and width  
JTAG port, provided for Boundary Scan function (PBGA Only)  
Independent Read and Write Clocks (permit reading and writing  
simultaneously)  
Availableina128-pinThinQuadFlatPack(TQFP)ora144-pinPlastic  
Ball Grid Array (PBGA) (with additional features)  
Pin compatible to the SuperSync II (IDT72V3640/72V3650/72V3660/  
72V3670/72V3680/72V3690)family  
FEATURES:  
Choose among the following memory organizations:  
IDT72V36100  
IDT72V36110  
65,536 x 36  
131,072 x 36  
Higher density, 2Meg and 4Meg SuperSync II FIFOs  
Up to 166 MHz Operation of the Clocks  
UserselectableAsynchronousreadand/orwriteports(PBGAOnly)  
User selectable input and output port bus-sizing  
- x36 in to x36 out  
- x36 in to x18 out  
- x36 in to x9 out  
- x18 in to x36 out  
- x9 in to x36 out  
Big-Endian/Little-Endian user selectable byte representation  
5V input tolerant  
Fixed, low first word latency  
Zero latency retransmit  
High-performance submicron CMOS technology  
Industrial temperature range (–40°C to +85°C) is available  
Green parts available, see ordering information  
Auto power down minimizes standby power consumption  
Master Reset clears entire FIFO  
Partial Reset clears data, but retains programmable settings  
FUNCTIONALBLOCKDIAGRAM  
*Available on the PBGA package only.  
D0 -Dn (x36, x18 or x9)  
LD SEN  
WEN  
WCLK/WR  
*
INPUT REGISTER  
OFFSET REGISTER  
FF/IR  
PAF  
EF/OR  
FLAG  
LOGIC  
PAE  
HF  
FWFT/SI  
PFM  
FSEL0  
FSEL1  
WRITE CONTROL  
LOGIC  
ASYW  
*
RAM ARRAY  
65,536 x 36  
131,072 x 36  
WRITE POINTER  
READ POINTER  
BE  
CONTROL  
LOGIC  
IP  
RT  
RM  
ASYR  
READ  
CONTROL  
LOGIC  
BM  
IW  
OW  
OUTPUT REGISTER  
BUS  
*
CONFIGURATION  
MRS  
PRS  
RESET  
LOGIC  
RCLK/RD  
*
REN  
TCK  
*
*
TRST  
TMS  
TDI  
TDO  
JTAG CONTROL  
(BOUNDARY  
SCAN)  
*
6117 drw01  
*
Q0 -Qn (x36, x18 or x9)  
OE  
*
*
IDTandtheIDTlogoareregisteredtrademarksofIntegratedDeviceTechnology,Inc.TheSuperSyncIIFIFOisatrademarkofIntegratedDeviceTechnology,Inc.  
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES  
DECEMBER 2016  
1
©
2016 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  
DSC-6117/15  

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