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71V546S133PFGI8 PDF预览

71V546S133PFGI8

更新时间: 2024-01-31 12:15:40
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
21页 228K
描述
Synchronous SRAM with ZBT Feature Burst Counter and Pipelined Outputs

71V546S133PFGI8 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TQFP
包装说明:QFP, QFP100,.63X.87针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.2
最长访问时间:4.2 ns最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e3内存密度:4718592 bit
内存集成电路类型:ZBT SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:100字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大待机电流:0.045 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.31 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.635 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
Base Number Matches:1

71V546S133PFGI8 数据手册

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Commercial and Industrial Temperature Ranges  
IDT71V546 128K x 36, 3.3V Synchronous SRAM with  
ZBT Feature, Burst Counter and Pipelined Outputs  
Pin Definitions(1)  
Symbol  
Pin Function  
I/O  
Active  
Description  
Address Inputs  
I
N/A  
Synchronous Address inputs. The address register is triggered by a  
combination of the rising edge of CLK and ADV/LD Low, CEN Low and true  
chip enables.  
A0 - A16  
ADV/LD  
Address/Load  
I
N/A  
ADV/LD is a synchronous input that is used to load the internal registers with  
new address and control when it is sampled low at the rising edge of clock with  
the chip selected. When ADV/LD is low with the chip deselected, any burst in  
progress is terminated. When ADV/LD is sampled high then the internal burst  
counter is advanced for any burst that was in progress. The external addresses  
are ignored when ADV/LD is sampled high.  
R/W  
Read/Write  
I
I
N/A  
R/W signal is a synchronous input that identified whether the current load cycle  
initiated is a Read or Write access to the memory array. The data bus activity for  
the current cycle takes place two clock cycles later.  
Clock Enable  
LOW  
Synchronous Clock Enable Input. When CEN is sampled high, all other  
synchronous inputs, including clock are ignored and outputs remain unchanged.  
The effect of CEN sampled high on the device outputs is as if the low to high  
clock transition did not occur. For normal operation, CEN must be sampled low  
at rising edge of clock.  
CEN  
Individual Byte  
Write Enables  
I
I
LOW  
LOW  
Synchronous byte write enables. Enable 9-bit byte has its own active low byte  
write enable. On load write cycles (When R/W and ADV/LD are sampled low)  
the appropriate byte write signal (BW1 - BW4) must be valid. The byte write  
signal must also be valid on each cycle of a burst write. Byte Write signals are  
BW1 - BW4  
ignored when R/W is sampled high. The appropriate byte(s) of data are written  
into the device two cycles later. BW1 - BW4 can all be tied low if always doing  
write to the entire 36-bit word.  
Chip Enables  
Synchronous active low chip enable. CE  
1
and CE  
2
are used with CE  
2 to  
CE1, CE2  
enable the IDT71V546. (CE or CE sampled high or CE2  
1
2
sampled low) and  
ADV/LD low at the rising edge of clock, initiates a deselect cycle. the ZBT  
has a two cycle deselect, i.e., the data bus will tri-state two clock cycles after  
deselect is initiated.  
CE2  
CLK  
Chip Enable  
Clock  
I
I
HIGH  
N/A  
Synchronout active high chip enable. CE  
2
is used with CE  
1
and CE  
2 to enable  
the chip. CE has inverted polarity but otherwise identical to CE  
2
1
and CE2.  
This is the clock input to the IDT71V546. Except for OE, all timing references for  
the device are made with respect to the rising edge of CLK.  
I/O  
I/OP1 - I/OP4  
0
- I/O31  
Data Input/Output  
I/O  
I
N/A  
Synchronous data input/output (I/O) pins. Both the data input path and data  
output path are registered and triggered by the rising edge of CLK.  
Linear Burst  
Order  
LOW  
Burst order selection input. When LBO is high the Interleaved burst sequence is  
selected. When LBO is low the Linear burst sequence is selected. LBO is a  
static DC input.  
LBO  
Output Enable  
I
LOW  
Asynchronous output enable. OE must be low to read data from the 71V546.  
When OE is high the I/O pins are in a high-impedance state. OE does not need  
to be actively controlled for read and write cycles. In normal operation, OE can  
be tied low.  
OE  
V
V
DD  
SS  
Power Supply  
Ground  
N/A  
N/A  
N/A  
N/A  
3.3V power supply input.  
Ground pin.  
3821 tbl 02  
NOTE:  
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.  
3
6.42  

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