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71V016SA20BFG8 PDF预览

71V016SA20BFG8

更新时间: 2024-02-25 18:56:41
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
9页 116K
描述
3.3V CMOS Static RAM

71V016SA20BFG8 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:CABGA
包装说明:BGA, BGA48,6X8,30针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.41
最长访问时间:20 ns其他特性:ALSO OPERATES WITH 3V TO 3.6 V SUPPLY
I/O 类型:COMMONJESD-30 代码:S-PBGA-B48
JESD-609代码:e1长度:7 mm
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:16湿度敏感等级:3
功能数量:1端子数量:48
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:64KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA48,6X8,30
封装形状:SQUARE封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.34 mm最大待机电流:0.01 A
最小待机电流:3 V子类别:SRAMs
最大压摆率:0.12 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:7 mm

71V016SA20BFG8 数据手册

 浏览型号71V016SA20BFG8的Datasheet PDF文件第2页浏览型号71V016SA20BFG8的Datasheet PDF文件第3页浏览型号71V016SA20BFG8的Datasheet PDF文件第4页浏览型号71V016SA20BFG8的Datasheet PDF文件第6页浏览型号71V016SA20BFG8的Datasheet PDF文件第7页浏览型号71V016SA20BFG8的Datasheet PDF文件第8页 
IDT71V016SA, 3.3V CMOS Static RAM  
1 Meg (64K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
AC Electrical Characteristics (VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
71V016SA10  
71V016SA12  
71V016SA15  
71V016SA20  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
____  
t
RC  
AA  
ACS  
Read Cycle Time  
10  
12  
15  
20  
ns  
ns  
ns  
ns  
____  
____  
____  
____  
t
Address Access Time  
10  
12  
15  
20  
____  
____  
____  
____  
t
Chip Select Access Time  
Chip Select Low to Output in Low-Z  
10  
12  
15  
20  
____  
____  
____  
____  
(1)  
CLZ  
4
4
5
5
t
____  
____  
____  
____  
(1)  
Chip Select High to Output in High-Z  
Output Enable Low to Output Valid  
Output Enable Low to Output in Low-Z  
5
6
6
8
ns  
ns  
ns  
t
CHZ  
____  
____  
____  
____  
tOE  
5
6
7
8
____  
____  
____  
____  
(1)  
(1)  
0
0
0
0
tOLZ  
____  
____  
____  
____  
Output Enable High to Output in High-Z  
Output Hold from Address Change  
Byte Enable Low to Output Valid  
Byte Enable Low to Output in Low-Z  
5
6
6
8
ns  
ns  
ns  
ns  
t
OHZ  
OH  
BE  
t
4
4
4
4
____  
t
5
6
7
8
____  
____  
____  
____  
(1)  
0
0
0
0
tBLZ  
(1)  
____  
____  
____  
____  
Byte Enable High to Output in High-Z  
5
6
6
8
ns  
tBHZ  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
AW  
CW  
BW  
AS  
WR  
WP  
DW  
DH  
Write Cycle Time  
10  
7
12  
8
15  
10  
10  
10  
0
20  
12  
12  
12  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Address Valid to End of Write  
Chip Select Low to End of Write  
Byte Enable Low to End of Write  
Address Set-up Time  
t
7
8
t
7
8
t
0
0
t
Address Hold from End of Write  
Write Pulse Width  
0
0
0
0
t
7
8
10  
7
12  
9
t
Data Valid to End of Write  
Data Hold Time  
5
6
t
0
0
0
0
____  
____  
____  
____  
(1)  
Write Enable High to Output in Low-Z  
3
3
3
3
tOW  
____  
____  
____  
____  
(1)  
WHZ  
Write Enable Low to Output in High-Z  
5
6
6
8
ns  
t
3834 tbl 10  
NOTE:  
1. This parameter is guaranteed with the AC Load (Figure 2) by device characterization, but is not production tested.  
Timing Waveform of Read Cycle No. 1(1,2,3)  
t
RC  
ADDRESS  
t
AA  
t
OH  
tOH  
DATAOUT VALID  
DATAOUT  
PREVIOUS DATAOUT VALID  
NOTES:  
1. WE is HIGH for Read Cycle.  
3834 drw 06  
2. Deviceiscontinuouslyselected,CSisLOW.  
3. OE, BHE, and BLE are LOW.  
5

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