Datasheet > 637-15ABEP

637-15ABEP

更新时间： 2024-09-18 21:15:55

品牌	Logo	应用领域
OHMITE		装置耐热支撑装置
页数	文件大小	规格书
1页	90K
描述
Heat Sink

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技术参数
数据手册

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637-15ABEP 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.57	耐热支撑装置类型：	HEAT SINK
Base Number Matches：	1

637-15ABEP 数据手册

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

High-Efficiency Heat Sinks For Vertical Board Mounting

637 SERIES

TO-220

Height Above

PC Board “A”

in. (mm)

Thermal Performance at Typical Load

Standard

P/N

Maximum Footprint

in. (mm)

Natural

Forced

Weight

lbs. (grams)

Convection

637-10ABEP

637-15ABEP

637-20ABEP

637-25ABEP

1.000 (25.4)

1.500 (38.1)

2.000 (50.8)

2.500 (63.5)

1.375 (34.9) x 0.500 (12.7)

76°C @ 6W

65°C @ 6w

55°C @ 6W

48°C @ 6W

5.8°C/W @ 200 LFM

5.5°C/W @ 200 LFM

4.7°C/W @ 200 LFM

4.2°C/W @ 200 LFM

0.023 (10.43)

0.035 (15.88)

0.050 (22.68)

0.062 (28.12)

Material: Aluminum, Black Anodized

Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi-

mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and

board space occupied must be minimized. Refer to the Accessory products section for thermal

interface materials, thermal compounds, and other accessories products.

637 SERIES

(EXTRUSION PROFILE 5183)

MECHANICAL DIMENSIONS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Dimensions: in. (mm)

1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com

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