HEAT SINK CO O LING
FO R IGBT MO DULES
TH E R M A L P R O D U C TS, I N C.
Aavid offers several m ethods for cooling
IGBT m odules – cold plates, extruded alu-
m inum heat sinks, bonded fin heat sinks,
and fan cooled m odules.
6-PASS CO LD PLATE
6-pass liquid-cooled cold plates offer optimum ther-
mal management for high power IGBT modules.They
are ideal for use in stationary or mobile applications
requiring high power dissipation and low thermal
resistance – welding, plasma, UPS/power supplies, and
motor controls in traction and electric vehicles.
FEATURES:
• Maximizes cooling in a compact package
• Fits all standard IGBT module sizes
• Maintains uniform temperature under devices
• Available in multiple lengths for single and three-
phase design
1.720
(43.69)
4-PASS CO LD PLATE
1.00
(25.40)
1.00
(25.40)
REF
"X"
3.550
±0.060
(90.17)
7.000
(177.80)
5.00
(127.00)
3.00
(76.20)
2.00
(50.80)
REF
0.800
(20.32)
REF.
2.400
.001/inch
Roughness 63 RMS
X
(60.96)
3/8 O.D.
.001/inch
Roughness 63 RMS
Copper Tubing
0.049/0.050 Wall
.60
6063 Aluminum
PART#
(15.24)
0.600
(15.24)
3/8 O.D.
COPPER TUBING
0.049/0.050 WALL
6063 Aluminum
X
PART#
X
6.0” 416101U
12.0” 416201U
24.0” 416301U
6.0” 416501U
12.0” 416601U
MAX RECOMMENDED FLOW - 1.5 GPM
MAX RECOMMENDED FLOW - 1.5 GPM
6"
12"
24"
0.05
0.04
0.03
0.02
0.01
0.00
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0.000
20
16
12
8
40
35
30
25
20
15
10
5
6"
4
12"
0
0
0
1.0
2.0
3.0
4.0
5.0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
WATER FLOW RATE - GPM
WATER FLOW RATE - GPM
NOTES: THERMAL RESISTANCE BASED ON WATER, IF 50/50 WATER GLYCOL MIXTURE IS USED INCREASE THERMAL RESISTANCES BY 12%
THERMAL RESISTANCES SHOWN ARE FROM INLET WATER TEMPERATURE TO MOUNTING SURFACE HOT SPOTS
NOTES: THERMAL RESISTANCE BASED ON WATER, IF 50/50 WATER GLYCOL MIXTURE IS USED INCREASE THERMAL RESISTANCES BY 12%
THERMAL RESISTANCES SHOWN ARE FROM INLET WATER TEMPERATURE TO MOUNTING SURFACE HOT SPOTS