PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74F153DRG4
SN74F153N
ACTIVE
SOIC
PDIP
PDIP
SO
D
16
16
16
16
16
16
20
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
F153
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
N
25
25
Pb-Free
(RoHS)
0 to 70
SN74F153N
SN74F153N
74F153
SN74F153NE4
SN74F153NSR
SN74F153NSRE4
SN74F153NSRG4
SNJ54F153FK
N
Pb-Free
(RoHS)
0 to 70
NS
NS
NS
FK
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
0 to 70
SO
Green (RoHS
& no Sb/Br)
0 to 70
74F153
SO
Green (RoHS
& no Sb/Br)
0 to 70
74F153
LCCC
TBD
-55 to 125
5962-
9758301Q2A
SNJ54F
153FK
SNJ54F153J
SNJ54F153W
ACTIVE
ACTIVE
CDIP
CFP
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9758301QE
A
SNJ54F153J
W
5962-9758301QF
A
SNJ54F153W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
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