PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-9758301Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
9758301Q2A
SNJ54F
153FK
5962-9758301QEA
5962-9758301QFA
ACTIVE
ACTIVE
CDIP
CFP
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9758301QE
A
SNJ54F153J
W
5962-9758301QF
A
SNJ54F153W
JM38510/33902B2A
JM38510/33902BEA
JM38510/33902BFA
M38510/33902B2A
M38510/33902BEA
M38510/33902BFA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
16
16
20
16
16
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
JM38510/
33902B2A
JM38510/
33902BEA
W
FK
J
A42
JM38510/
33902BFA
LCCC
CDIP
CFP
POST-PLATE
A42
JM38510/
33902B2A
JM38510/
33902BEA
W
A42
JM38510/
33902BFA
SN54F153J
SN74F153D
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
-55 to 125
0 to 70
SN54F153J
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
F153
SN74F153DE4
SN74F153DG4
SN74F153DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
D
D
D
16
16
16
16
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
F153
F153
F153
F153
Green (RoHS
& no Sb/Br)
2500
2500
Green (RoHS
& no Sb/Br)
SN74F153DRE4
Green (RoHS
& no Sb/Br)
Addendum-Page 1