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5962-9460206QDA PDF预览

5962-9460206QDA

更新时间: 2024-09-16 22:21:07
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路输入元件
页数 文件大小 规格书
81页 1554K
描述
EXCALIBUR LOW-NOISE HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

5962-9460206QDA 技术参数

生命周期:Active零件包装代码:DFP
包装说明:DFP-14针数:14
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:6 weeks
风险等级:5.54Is Samacsys:N
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.06 µA25C 时的最大偏置电流 (IIB):0.06 µA
最小共模抑制比:80 dB标称共模抑制比:98 dB
频率补偿:YES最大输入失调电流 (IIO):0.02 µA
最大输入失调电压:3500 µVJESD-30 代码:R-GDFP-F14
长度:9.21 mm低-偏置:YES
低-失调:NO微功率:NO
负供电电压上限:-19 V标称负供电电压 (Vsup):-5 V
功能数量:4端子数量:14
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DFP
封装等效代码:FL14,.3封装形状:RECTANGULAR
封装形式:FLATPACK包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED功率:NO
电源:+-5/+-15 V可编程功率:NO
认证状态:Qualified筛选级别:MIL-PRF-38535 Class Q
座面最大高度:2.03 mm最小摆率:20 V/us
标称压摆率:40 V/us子类别:Operational Amplifier
最大压摆率:1.875 mA供电电压上限:19 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BIFET温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:10000 kHz最小电压增益:7900
宽带:NO宽度:6.285 mm
Base Number Matches:1

5962-9460206QDA 数据手册

 浏览型号5962-9460206QDA的Datasheet PDF文件第1页浏览型号5962-9460206QDA的Datasheet PDF文件第3页浏览型号5962-9460206QDA的Datasheet PDF文件第4页浏览型号5962-9460206QDA的Datasheet PDF文件第5页浏览型号5962-9460206QDA的Datasheet PDF文件第6页浏览型号5962-9460206QDA的Datasheet PDF文件第7页 
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SLOS181B − FEBRUARY 1997 − REVISED APRIL 2004  
TLE2071 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
CERAMIC  
FLAT PACK  
(U)  
IO  
SMALL  
OUTLINE  
(D)  
T
A
CHIP CARRIER  
(FK)  
CERAMIC DIP  
(JG)  
PLASTIC DIP  
(P)  
AT 25°C  
2 mV  
4 mV  
TLE2071ACD  
TLE2071CD  
TLE2071ACP  
TLE2071CP  
0°C to 70°C  
40°C to 85°C  
55°C to 125°C  
2 mV  
4 mV  
TLE2071AID  
TLE2071ID  
TLE2071AIP  
TLE2071IP  
2 mV  
4 mV  
TLE2071AMFK  
TLE2071MFK  
TLE2071AMJG  
TLE2071MJG  
TLE2071AMU  
TLE2071MU  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2071ACDR).  
TLE2072 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLAT PACK  
(U)  
IO  
SMALL  
OUTLINE  
(D)  
T
A
AT 25°C  
(JG)  
(P)  
3.5 mV  
6 mV  
TLE2072ACD  
TLE2072CD  
TLE2072ACP  
TLE2072CP  
0°C to 70°C  
40°C to 85°C  
55°C to 125°C  
3.5 mV  
6 mV  
TLE2072AID  
TLE2072ID  
TLE2072AIP  
TLE2072IP  
3.5 mV  
6 mV  
TLE2072AMFK  
TLE2072MFK  
TLE2072AMJG  
TLE2072MJG  
TLE2072AMU  
TLE2072MU  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2072ACDR).  
TLE2074 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLAT PACK  
(W)  
IO  
SMALL  
OUTLINE  
(DW)  
T
A
AT 25°C  
(J)  
(N)  
3 mV  
5 mV  
TLE2074ACDW  
TLE2074CDW  
TLE2074ACN  
TLE2074CN  
0°C to 70°C  
40°C to 85°C  
55°C to 125°C  
3 mV  
5 mV  
TLE2074AIDW  
TLE2074IDW  
TLE2074AIN  
TLE2074IN  
3 mV  
5 mV  
TLE2074AMFK  
TLE2074MFK  
TLE2074AMJ  
TLE2074MJ  
TLE2074AMW  
TLE2074MW  
The DW packages are available taped and reeled. Add R suffix to device type (e.g., TLE2074ACDWR).  
symbol  
+
IN+  
IN−  
OUT  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

5962-9460206QDA 替代型号

型号 品牌 替代类型 描述 数据表
TLE2074AMWB TI

完全替代

EXCALIBUR LOW-NOISE HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS
TLE2074MWB TI

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