Datasheet > 500R07S0R2AV4T

500R07S0R2AV4T

更新时间： 2024-09-08 12:54:15

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约翰逊 - JOHANSON		/
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APPLICATION NOTES FOR CERAMIC CHIP CAPACITORS

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500R07S0R2AV4T 数据手册

APPLICATION

OTES FOR

ERAMIC

HIP

APACITORS

ENERAL

OLDER

RE-HEAT

YCLE

Ceramic chip capacitors exhibit excellent reliability

characteristics providing that proper circuit design

techniques and controlled assembly processes are

utilized. Due to the ceramic capacitor’s crystalline

micro-structure these components are susceptible

when exposed to excessive thermal or mechanical

shock during circuit processing. It should be noted that

micro-cracks in ceramic can be difficult to detect with

normal post assembly visual and electrical testing and

can pose a significant threat to reliable field operation.

For this reason it is recommended that the assembly

qualification process employ suitable testing to expose

the presence of micro-cracking conditions.

Proper preheating is essential to prevent thermal shock

cracking of the capacitor. The circuit assembly should

be preheated as shown in the recommended profiles at

a rate of 1.0 to 2.0°C per second to within 65 to 100°C

of the maximum soldering temperature.

OLDERING

TEMPERATURES

Solders typically utilized in SMT have melting points

between 179°C and 188°C. Activation of rosin fluxes

occurs at about 200°C. Based on these facts a

minimum peak reflow temperature of 205°C to 210°C

should be established. A maximum peak reflow

temperature of 225°C should be adequate in most

circumstances. Many reflow process profiles have

peaks ranging from 240°C to 260°C and while ceramic

capacitors can withstand soldering temperatures in

this range for short durations they should be minimized

or avoided whenever possible. Use of PCB mounted

multiple thermocouple M.O.L.E. profiling is advised for

accurate characterization of circuit heat absorption and

maximum temperature conditions.

HIP

APACITOR

ATTACHMENT

LASERtrim CAPACITORS - Offered with gold

flashed nickel-barrier terminations only. Due to the

unique internal construction of the LASERtrim

it is recommended that a conservative reflow

temperature profile be used ( Fig. 1). Wave soldering is

discouraged.

HIGH FREQUENCY CAPACITORS & INDUCTORS

- Offered with standard tin plated nickel-barrier

terminations compatible with solder flow and reflow

processes.

MICROWAVE SINGLE LAYER CAPACITORS - Offered

with Titanium-Tungsten/Gold and Titanium-Tungsten/

Nickel/Gold thin-film termination as well as legacy

Platinum/Palladium/Gold terminations. Please refer to

the attachment compatibility table (page 31) specific to

these devices.

EFLOW

OLDER

The general term “reflow” refers to several methods

used in heating the circuit so that solder paste reflows,

or “wetting” of the ceramic capacitor and PCB contacts

occurs. These methods include infra-red, convection

and radiant heating. The size of the solder fillet may be

controlled by varying the amount of solder paste that is

screened onto the circuit. Recommended temperature

limits for solder reflow are shown in Figure 1 for

LASERtrim® and in Figure 2 for standard capacitors.

OLDERING RON

APOR

HASE

Ceramic capacitor attachment with a soldering iron

is discouraged due to the inherent limitations on

precisely controlling soldering temperature, heat

transfer rate, and time. In the event that a soldering

iron must be employed the following precautions are

recommended.

A typical vapor phase soldering process consists of

several temperature zones created by saturated vapor

from a boiling liquid. As the circuit passes through the

zone the vapor condenses on the solder paste, pad,

and termination resulting in heat transfer and reflow

of the solder paste. Vapor phase reflow produces

consistent circuit heating with reflow occurring at a

relatively lower temperature that is determined by the

known boiling point of the liquid used, typically 215°C.

Recommended temperature limits for vapor phase

reflow are shown in Figure 3.

• Preheat circuit and capacitors to 150°C

• Never contact the ceramic with the iron tip

• 30 watt iron output (max)

• 280°C tip temperature (max)

• 3.0 mm tip diameter (max)

• Limit soldering time to 5 sec.

www.johans ontechnology.com

12 3

中文翻译

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500R07S0R2AV4T 替代型号

型号	品牌	替代类型	描述	数据表
CBR04C208A5GAC	KEMET	类似代替	Ceramic, High Q, Microwave (CBR), 0.2 pF, /-0.05 pF, 50 V, 0402, C0G, SMD, Fixed, RF, Ultr
GRM1555C1HR20WA01D	MURATA	功能相似	Chip Monolithic Ceramic Capacitors

与500R07S0R2AV4T相关器件

型号	品牌	获取价格	描述	数据表
500R07S0R2C14T	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,
500R07S0R3AU4R	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,
500R07S0R4AV4T	JOHANSON	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 50V, 12.5% +Tol, 12.5% -Tol, C0G, 30ppm/Cel TC, 0.
500R07S0R4B44T	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,
500R07S0R5AV4T	JOHANSON	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0000
500R07S0R5C24W	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,
500R07S0R8A14R	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,
500R07S0R8BV4T	JOHANSON	获取价格	Chip Capacitor Pack aging Information
500R07S0R8CC4R	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,
500R07S100G44R	JOHANSON	获取价格	Ceramic Capacitor, Ceramic,

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