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2SK1544Q PDF预览

2SK1544Q

更新时间: 2024-11-13 12:35:51
品牌 Logo 应用领域
东芝 - TOSHIBA 转换器电机驱动
页数 文件大小 规格书
6页 381K
描述
DC−DC Converter and Motor Drive Applications

2SK1544Q 数据手册

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2SK1544  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSIII.5)  
2SK1544  
DCDC Converter and Motor Drive Applications  
Unit: mm  
z Low drainsource ON resistance  
z High forward transfer admittance  
: R  
= 0.15 (typ.)  
DS (ON)  
: |Y | = 21 S (typ.)  
fs  
z Low leakage current  
z Enhancement mode  
: I  
= 300 μA (max) (V  
= 500 V)  
DSS  
DS  
: V = 1.5 to 3.5 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drainsource voltage  
Symbol  
Rating  
Unit  
V
500  
500  
V
V
V
DSS  
Draingate voltage (R  
Gatesource voltage  
= 20 k)  
V
GS  
DGR  
V
±30  
GSS  
DC (Note 1)  
Pulse (Note 1)  
I
25  
D
JEDEC  
JEITA  
Drain current  
A
I
100  
DP  
Drain power dissipation (Tc = 25°C)  
Channel temperature  
P
200  
W
°C  
°C  
D
ch  
stg  
TOSHIBA  
2-21F1B  
T
150  
Weight: 9.75 g (typ.)  
Storage temperature range  
T
55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and  
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Thermal Characteristics  
Characteristics  
Symbol  
Max  
0.625  
35.7  
Unit  
Thermal resistance, channel to case  
R
°C / W  
°C / W  
th (chc)  
th (cha)  
Thermal resistance, channel to  
ambient  
R
Note 1: Ensure that the channel temperature does not exceed 150°C.  
This transistor is an electrostatic-sensitive device.  
Please handle with caution.  
1
2009-09-29  

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