ON Semiconductort
1 DRAIN
JFET Switching
N–Channel — Depletion
3
2N5555
GATE
2 SOURCE
MAXIMUM RATINGS
Rating
Symbol
Value
25
Unit
Vdc
Drain–Source Voltage
Drain–Gate Voltage
Gate–Source Voltage
Forward Gate Current
V
DS
DG
GS
GF
V
V
25
Vdc
25
Vdc
I
10
mAdc
1
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
350
2.8
mW
mW/°C
2
3
C
Junction Temperature Range
Storage Temperature Range
T
–65 to +150
–65 to +150
°C
°C
J
CASE 29–11, STYLE 5
TO–92 (TO–226AA)
T
stg
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Gate–Source Breakdown Voltage (I = 10 µAdc, V
DS
= 0)
V
25
—
—
Vdc
G
(BR)GSS
Gate Reverse Current (V
GS
= 15 Vdc, V
= 0)
I
1.0
nAdc
DS
GSS
Drain Cutoff Current (V
Drain Cutoff Current (V
= 12 Vdc, V
= 12 Vdc, V
= –10 V)
= –10 V, T = 100°C)
I
D(off)
—
—
10
2.0
nAdc
µAdc
DS
DS
GS
GS
A
ON CHARACTERISTICS
(1)
Zero–Gate–Voltage Drain Current
I
15
—
—
—
—
1.0
1.5
150
mAdc
Vdc
DSS
(V
DS
= 15 Vdc, V
= 0)
GS
Gate–Source Forward Voltage
(I = 1.0 mAdc, V = 0)
V
GS(f)
G(f)
Drain–Source On–Voltage
(I = 7.0 mAdc, V = 0)
DS
V
Vdc
DS(on)
D
GS
Static Drain–Source On Resistance
(I = 0.1 mAdc, V = 0)
r
Ohms
DS(on)
D
GS
1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 3.0%.
SMALL–SIGNAL CHARACTERISTICS
Small–Signal Drain–Source “ON” Resistance
r
—
—
—
150
5.0
1.2
Ohms
pF
ds(on)
(V
GS
= 0, I = 0, f = 1.0 kHz)
D
Input Capacitance
(V = 15 Vdc, V
C
iss
rss
= 0, f = 1.0 MHz)
GS
DS
Reverse Transfer Capacitance
(V = 0, V = 10 Vdc, f = 1.0 MHz)
C
pF
DS GS
SWITCHING CHARACTERISTICS
Turn–On Delay Time
Rise Time
(V
= 10 Vdc, I
= 7.0 mAdc,
= –10 Vdc) (See Figure 1)
t
t
—
—
—
—
5.0
5.0
15
ns
ns
ns
ns
DD
D(on)
d(on)
V
= 0, V
GS(on)
GS(off)
t
r
Turn–Off Delay Time
Fall Time
(V
= 10 Vdc, I
= 7.0 mAdc,
= –10 Vdc) (See Figure 1)
DD
D(on)
d(off)
V
= 0, V
GS(on)
GS(off)
t
f
10
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
November, 2001 – Rev. 3
2N5555/D