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2N5064 PDF预览

2N5064

更新时间: 2024-11-12 20:19:35
品牌 Logo 应用领域
DIGITRON 栅极
页数 文件大小 规格书
5页 888K
描述
Silicon Controlled Rectifier; Max Peak Repetitive Reverse Voltage: 200; Max TMS Bridge Input Voltage: 0.51; Max DC Reverse Voltage: 0.05; Capacitance: 5; Package: TO-92

2N5064 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.66
Is Samacsys:NBase Number Matches:1

2N5064 数据手册

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2N5060-2N5064  
SILICON CONTROLLED RECTIFIERS  
High-reliability discrete products  
and engineering services since 1977  
FEATURES  
Available as “HR” (high reliability) screened per MIL-PRF-19500, JANTX level. Add “HR” suffix to base part number.  
Available as non-RoHS (Sn/Pb plating), standard, and as RoHS by adding “-PBF” suffix.  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
2N5060  
2N5061  
2N5062  
2N5064  
30  
60  
Peak repetitive off-state voltage (1)  
VDRM  
VRRM  
(TJ = -40 to +110°C, sine wave, 50 to 60 Hz, gate open)  
100  
200  
On-state current RMS (180° conduction angles, TC = 80°C)  
IT(RMS)  
0.8  
A
Average on-state current  
(180° conduction angles)  
(TC = 67°C)  
IT(AV)  
A
0.51  
(TC = 102°C)  
0.255  
Peak non-repetitive surge current  
(TA = 25°C)  
ITSM  
10  
A
(1/2 cycle, sine wave, 60Hz)  
Circuit fusing considerations  
I2t  
0.4  
A2s  
(t = 8.3 ms)  
Average on-state current  
(180° conduction angles)  
(TC = 67°C)  
IT(AV)  
A
0.51  
(TC = 102°C)  
0.255  
Forward peak gate power  
PGM  
PG(AV)  
IGM  
0.1  
0.01  
1.0  
W
W
A
≤ 1.0µsec; T  
(Pulse width  
A = 25°C)  
Forward average gate power  
(TA = 25°C, t = 8.3ms)  
Forward peak gate current  
≤ 1.0µsec; T  
(Pulse width  
Reverse peak gate voltage  
≤ 1.0µsec; T  
A = 25°C)  
VRGM  
5.0  
V
(Pulse width  
A = 25°C)  
Operating junction temperature range  
Storage temperature range  
TJ  
-40 to +110  
-40 to +150  
°C  
°C  
Tstg  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously.  
If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.  
1.  
VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential  
on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.  
THERMAL CHARACTERISTICS  
Characteristics  
Symbol  
RθJC  
Max  
75  
Unit  
°C/W  
°C/W  
Thermal resistance, junction to case  
Thermal resistance, junction to ambient  
Lead solder temperature  
RθJA  
200  
-
230  
°C  
≥ 1/16” from case, 10 s max.)  
(lead length  
Rev. 20130116  

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