2FAJ-M16R

更新时间： 2024-11-16 02:56:47

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
4页	282K
描述
Integrated Passive & Active Device using MLP

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中文翻译

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数据手册

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2FAJ-M16R 数据手册

Features

Applications

■ Lead free as standard

■ RoHS compliant*

■ ESD protection

■ Cell Phones

■ PDAs and Notebooks

■ GPS and SMART Cards

■ Protects up to eight data lines

■ Low insertion loss

2FAJ-M16R – Integrated Passive & Active Device using MLP

General Information

The 2FAJ-M16R device, manufactured using Thin Film on

Silicon technology, provides ESD protection for the external

ports of portable electronic devices such as cell phones,

modems and PDAs.

I/O PADS

GROUND

PAD

The ESD protection provided by the component enables a

data port to withstand a minimum ±± ꢀK ꢁontact ꢂ±1ꢃ ꢀK Air

Discharge per the ESD test method specified in IEꢁ 61000-4-2.

The device measures 3 mm x 3 mm and is intended to be

mounted directly onto an FR4 printed circuit board. The MLP

device meets typical thermal cycle and bend test specifications.

MLP

PACKAGE

Electrical & Thermal Characteristics

Electrical Characteristics

Symbol

Minimum

Nominal

Maximum

Unit

(T = 2ꢃ °ꢁ unless otherwise noted)

Resistance

ꢁ

100

110

Ω

ꢁapacitance @ 2.ꢃ K 1 MHz

Rated Standoff Koltage

Breakdown Koltage @ 1 mA

Forward Koltage @ 10 mA

Leakage ꢁurrent @ 3 K

ꢃ.0

6.0

0.±

0.1

µA

ESD Protection: IEꢁ 61000-4-2

ꢁontact Discharge

±±

±1ꢃ

Air Discharge

Thermal Characteristics

(T = 2ꢃ °ꢁ unless otherwise noted)

Dꢁ Power Rating

100

+±ꢃ

°ꢁ

Operating Temperature Range

Storage Temperature Range

-40

-ꢃꢃ

2ꢃ

STG

+1ꢃ0

°ꢁ

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

12 3 4

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